User's Notice; Manual Revision Information; Thermal Solutions - JETWAY 815EDA1A User Manual

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Manual Revision Information

Reversion Revision History
1.0 First Release
Item Checklist
Motherboard
Cable for IDE/Floppy
CD for motherboard utilities
Cable for USB Port 3/4 (Option)
□
Cable for COM2 (Option)
User's Manual
Intel  Processor Family

Thermal Solutions

As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the proper
thermal environment is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heatsinks evaluated and recommended by Intel for use with Intel processors.
Vendor list for heatsink and fan of Pentium® III processor, please visit：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel® Celeron™ processor, please visit：
http://developer.intel.com/design/celeron/components/index.htm
THE MANUFACTURER. NO PART OF THIS
THE MANUFACTURER.
MANUFACTURER PROVIDES THIS MANUAL "AS IS"
Date
July 2002
1