Thermal Interface Material - TYAN THUNDER K8S PRO Manual

of installation and information on choosing the appropriate heatsink, use heatsinks
validated by AMD. Please refer to AMD's website at www.amd.com.
The following diagram will illustrate how to install the most common CPU back plates:
2.31 – Thermal Interface Material
Always check with the manufacturer of the heatsink & processor to
NOTE ensure the Thermal Interface material is compatible with the
processor & meets the manufacturer's warranty requirements
There are two types of thermal
interface materials designed for
use with the AMD Opteron
processor.
The most common material
comes as a small pad attached
to the heatsink at the time of
purchase. There should be a
protective cover over the
material. Take care not to touch
this material.
Simply remove the protective
cover and place the heatsink on
the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as 'thermal
compound'. Simply apply a thin
layer on to the CPU lid (applying
too much will actually reduce the
cooling).
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1. Mounting screws
2. Heatsink retention frame
3. CPU socket
4. Motherboard PCB
5. Adhesive insulator material
6. Backplate assembly
NOTE: Please see next section
for specific instructions on how
to install mounting bracket.