Table of Contents
Advertisement
Case Temperature Reference Metrology
18. Place a 3
Figure 7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
19. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1.step 3 (Figure 7-23).
Figure 7-23. Measuring Resistance Between Thermocouple and IHS
20. Using a fine point device, place a small amount of flux on the thermocouple bead.
Be careful not to move the thermocouple bead during this step (Figure 7-24).
Ensure the flux remains in the bead area only.
Thermal and Mechanical Design Guidelines
rd
piece of tape at the end of the step in the groove as shown in
99
Advertisement
Table of Contents
