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9 Applications, Implementation, and Layout
9.1 Typical Application
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI's customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1.1 Schematic
TI recommends connecting a combination of a 10-µF and a 0.1-µF low-ESR ceramic decoupling capacitor
across the VDD and VSS pins, as well as placing these capacitors as close as possible to the supply pins that
they decouple (within a few millimeters) to achieve a minimal loop area. The 10-µF bulk decoupling capacitor
is a recommended value for most applications, but this capacitance can be adjusted if needed based upon the
PCB design and application requirements. For example, larger bulk capacitors can be used, but this can affect
the supply rail ramp-up time.
The NRST reset pin must be pulled up to VDD (supply level) for the device to release from RESET state and
start the boot process. TI recommends connecting an external 47-kΩ pullup resistor with a 10-nF pulldown
capacitor for most applications, enabling the NRST pin to be controlled by another device or a debug probe.
The SYSOSC frequency correction loop (FCL) circuit utilizes an external 100-kΩ with 0.1% tolerance resistor
with a temperature coefficient (TCR) of 25ppm/C or better populated between the ROSC pin and VSS. This
resistor establishes a reference current to stabilize the SYSOSC frequency through a correction loop. This
resistor is required if the FCL feature is used for higher accuracy, and it is not required if the SYSOSC FCL is not
enabled. When the FCL mode is not used, the PA2 pin can be used as a digital input/output pin.
A 0.47-µF tank capacitor is required for the VCORE pin and must be placed close to the device with minimum
distance to the device ground. Do not connect other circuits to the VCORE pin.
For the 5-V-tolerant open drain (ODIO), a pullup resistor is required to output high for I2C and UART functions,
as the open drain IO only implement a low-side NMOS driver and no high-side PMOS driver. The 5-V-tolerant
open drain IOs are fail-safe and can have a voltage present even if VDD is not supplied.
1.62 - 3.6 V
¤
NRST
10nF
Copyright © 2023 Texas Instruments Incorporated
VDD
10 F
0.1
F
¡
VSS
VCORE
0.47
F
£
NRST
The NRST pullup
resistor and capacitor
are optional, but
NRST must be
pulled high to VDD
for the device to start.
Figure 9-1. Basic Application Schematic
Product Folder Links:
MSPM0G3507-Q1 MSPM0G3506-Q1 MSPM0G3505-Q1
MSPM0G3507-Q1, MSPM0G3506-Q1, MSPM0G3505-Q1
Note
MSPM0 MCU
R
100 k
±0.1% ±25ppm
PA2/ROSC
PA0
PA1
5V-tolerant open drain pins
Pull-up resistors are required for output high
SWDIO
SWCLK
Debug interface
SLASF88 – OCTOBER 2023
1.62 - 5.5 V
OSC
¢
Debug tool
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