Panasonic AG-DVC30P Service Manual page 7

ES devices are integrated circuits and some field-effect transistors and semiconductor "chip"
components. The following techniques should be used to help reduce the incidence of
component damage caused by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. /
Alternatively, obtain and wear a commercially available
discharging wrist trap device, which should be removed for
potential shock reasons prior to applying power to the unit under
test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device classified as "anti-
static" can generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. /
(most replacement ES devices are package with leads electrically
shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed. / CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpacked replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity sufficient to damage
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