Service Bulletins; Isolating Component Failures - IBM BladeCenter S Problem Determination And Service Manual

Service bulletins

IBM continually updates the support Web site with tips and techniques that you
can use to resolve any problems that you may be having with the BladeCenter S
system.
To find any service bulletins that are available for the BladeCenter S Types 7779
and 8886, go to the BladeCenter support search Web site at http://www.ibm.com/
systems/support/supportsite.wss/search?brandind=5000020. In the Search field,
enter the following terms: 8886 and retain.

Isolating component failures

There are times when the only way to isolate the cause of a problem is to start
removing components until the problem is resolved. Use this procedure to assist in
isolating the root cause of a problem.
Problem
You are having problems with the BladeCenter S system, but you are unable to
isolate the problem to a single component.
Note: Before you begin attempting to isolate problems to a specific component,
you should first view the advanced management module and attempt to resolve
any problems that are found.
To view the event log:
v From the advanced management module Web interface, click Monitors > Event
v From the advanced management module command-line interface, enter the
Investigation
Perform these steps to isolate problems to a specific component:
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BladeCenter S Type 7779/8886: Problem Determination and Service Guide
log.
For more information about the advanced management module Web interface,
see the Advanced management module User's Guide.
displaylog command.
For more information about the advanced management module command-line
interface, see the Advanced management module Command-Line Interface Reference
Guide.
1. Power down and disengage all blade servers from the BladeCenter S chassis
midplane. Open the release handles and the blade servers will slide out of the
bay approximately one inch.
2. Make sure there is a working power supply in power module bay 1 and
disengage power supplies 2, 3, and 4 (pull them out approximately one inch.
3. Disengage the following components from the midplane:
a. Open the release handles on all I/O modules.
Important: Disengaging an I/O module will disrupt communications with
any external devices that are attached to that I/O module. Make sure that
all external devices are powered down before disengaging an I/O module.
b. Open the release handles on the storage modules.