Thermal Consideration - Quectel LTE-A Series Hardware Design

application that incorporates the module.
The following table shows the electrostatic discharge characteristics of the module.
Table 36: Electrostatic Discharge Characteristics
Tested Points
VBAT, GND
Antenna Interfaces
Other Interfaces

5.8. Thermal Consideration

To achieve better performance of the module, it is recommended to comply with the following principles
out of thermal considerations:
⚫
In your PCB design, place the module away from heating sources, especially high power
components, such as ARM processor, audio power amplifier, power supply, etc.
⚫
Do not place components on the opposite side of the PCB area where the module is mounted and do
not cover that area with copper allowing for the adding of heatsink when necessary.
⚫
Ensure the reference ground of the area where the module is mounted is complete, and add as many
ground vias as possible for better heat dissipation.
⚫
Make sure the ground pads of the module and PCB are fully connected.
⚫
According to particular application demands, mount the heatsink on the top of the module, or the
opposite side of the PCB area where the module is mounted, or both of them.
⚫
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between heatsink and
module/PCB.
EG060V-EA_Hardware_Design
Contact Discharge
±5
±4
±0.5
LTE-A Module Series
EG060V-EA Hardware Design
Air Discharge
±10
±8
±1
Unit
kV
kV
kV
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