Infrared Transceiver Module - Nokia NSB-5 Series Technical Documentation Manual

PAMS Technical Documentation
Pin Name Parameter
2 VSIM 5V SIM Card
3V SIM Card
3 DATA 5V Vin/Vout
3V Vin/Vout
4 SIMRST 5V SIM Card
3V SIM Card
5 SIMCLK Frequency
Trise/Tfall
6 VPP 5V SIM Card
3V SIM Card
VSIM supply voltages are specified to meet type approval requirements regardless of the
tolerances in components.

Infrared Transceiver Module

An infrared transceiver module is designed as a substitute for hardwired connections
between the phone and a PC. The infrared transceiver module is a stand alone compo-
nent. In DCT3 the module is located inside and at the top of the phone.
The Rx and Tx is connected to the FBUS via a dual bus buffer. The module and buffer is
activated from the MAD2 with a pull up on IRON. The Accif in MAD2 performs pulse
encoding and shaping for transmitted data pulses and detection and decoding for
received data pulses.
The data is transferred over the IR link using serial FBUS data at speeds 9.6, 19.2, 38.4,
57.6 or 115.2 kbits/s, which leads to maximum throughput of 92.160 kbits/s. The used IR
module complies with the IrDA SIR specification (Infra Red Data Association), which is
based on the HP SIR (Hewlett–Packard's Serial Infra Red) concept.
Issue 1 03/01
Table 4: SIM Connector Electrical Specifications
Min Typ
4.8 5.0
2.8 3.0
4.0 "1"
0 "0"
2.8 "1"
0 "0"
4.0 "1"
2.8 "1"
3.25
4.8 5.0
2.8 3.0
Nokia Mobile Phones Ltd.
Max Unit
5.2 V Supply voltage
3.2
VSIM V
0.5 Trise/Tfall max 1 us
VSIM
0.5
VSIM V
VSIM
MHz SIM clock
25 ns
5.2 V Programming voltage
3.2 pin6 and pin2 tied
NSB-5
System Module
Notes
SIM data
SIM reset
together
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