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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com
Characteristic
Silicon substrate
Soft / brittle
Gallium arsenide
Soft / brittle
Boron composites
Very brittle
Ceramic fiber com-
Very brittle
posites
Glasses
Brittle
Minerals
Friable / brittle
Alumina ceramic
Hard / tough
Zirconia (PSZ)
Hard / tough
Silicon nitride
Hard / tough
Metal matrix
composites
General purpose
9.2 CUTTING PARAMETERS
Most wafer cutting is done at speed between 50 rpm and 5000 rpm with loads varying from 10-1000
grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals)
and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates) (see
Table IV). It is interesting to note that the cutting efficiency for sectioning hard/tough ceramics
improves at higher speeds and higher loads. Figure 9.8 compares the resulting surface finish for
sectioning partially stabilized zirconia at a low speed/low load (Figure 9-8a) vs cutting at a higher
load/higher speed (Figure 9-8b). As can be seen, partially stabilized zirconia has less fracturing and
grain pull out after sectioning at higher speeds and loads. This observation may seem counter
intuitive, however for sectioning hard/tough ceramics, high cutting speeds and loads result in
producing a crack that propagates in the direction of the cut instead of laterally into the specimen.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
PICO-155S Precision Saw
TABLE IV. Guidelines for Wafering Cutting Various Materials
Speed (rpm)
<300
<200
500
1000
1000
1500
1500
1500
1500
1500
Variable
I
NSTRUCTION
Web: http://www.metallographic.com
Load (grams)
Blade (grit/conc.)
<100
Fine / low
<100
Fine / low
250
Fine / low
500
Fine / low
500
Fine / low
>500
Medium / low
>500
Medium / low
>800
Medium / low
>800
Medium / low
>500
Medium / high
Variable
Medium / high
M
ANUAL
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