IBM Power Systems S822LC Technical Overview And Introduction page 48

RAS enhancements of POWER8 processor-based scale-out servers
The Power S822LC servers, in addition to being built on advanced RAS characteristics of the
POWER8 processor, offer reliability and availability features that often are not seen in such
scale-out servers.
Here is a brief summary of these features:
Processor enhancements integration
POWER8 processor chips are implemented by using 22 nm technology, and are
integrated on SOI modules.
The processor design supports a spare data lane on each fabric bus, which is used to
communicate between processor modules. A spare data lane can be substituted for a
failing one dynamically during system operation.
A POWER8 processor module has improved performance, including support of a
maximum of 12 cores because doing more work with less hardware in a system supports
greater reliability. The Power S822LC servers offer two processor socket offerings with
8-core and 10-core processor configurations. So, there are 16-core and 20-core
configurations that are available.
The On Chip Controller (OCC) monitors various temperature sensors in the processor
module, memory modules, and environmental temperature sensors, and steers the
throttling of processor cores and memory channels if the temperature rises over
thresholds that are defined by the design. The power supplies have their own independent
thermal sensors and monitoring.
Power supplies and voltage regulator modules monitor Over-Voltage, Under-Voltage, and
Over-Current conditions. They report to a "power good" tree that is monitored by the
service processor.
I/O subsystem
The PCIe controllers are integrated into the POWER8 processor. All the PCIe slots are
directly driven by the PCIe controllers.
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IBM Power Systems S822LC for High Performance Computing