Basic Components Of The Io Device - Siemens SIMATIC ET 200SP HA System Manual

3.2

Basic components of the IO device

Basic components for configuration of IO devices
The following tables show the components for configuring IO devices based on the ET 200SP
HA distributed I/O.
Table 3-2 Rail
The rail is the component on which the modules of the IO device are
attached.
The upper part corresponds to a standard rail (width 35 mm).
Table 3-3 Carrier module for interface module
Carrier modules for interface modules are available in the following
versions:
● Carrier module for 1 interface module
(required for singular connection of the IO device to PROFINET
IO)
● Carrier module for 2 interface modules
(required for redundant connection of the IO device to
PROFINET IO)
The carrier modules connect the interface module to the backplane
bus.
They enable data exchange with the I/O modules.
Note:
Interface modules cannot be plugged in if the corresponding con‐
nector for the supply voltage is plugged in beforehand.
ET 200SP HA Distributed I/O system
System Manual, 08/2019, A5E39261167-AD
Function
Function
System overview
3.2 Basic components of the IO device
Figure
Figure
17