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Level Location No.
C211,
C212,
C213,
C219,
Capacitor, Ceramic,
6
C222,
Chip
C322,
C329,
C453,
C457
VA200,
VA201,
VA202,
VA207,
VA208,
VA209,
6
VA210,
Varistor
VA211,
VA212,
VA300,
VA307,
VA308,
VA309
R204,
6
R325,
Resistor, Chip
R326
C112,
Capacitor, Ceramic,
6
C113
Chip
R304,
R305,
6
R306,
Resistor, Chip
R307,
R308
C111,
Capacitor, Ceramic,
6
C125
Chip
Inductor, Multilayer,
6
L409
Chip
C122,
Capacitor, Ceramic,
6
C204,
Chip
C429
Capacitor, Ceramic,
6
C257
Chip
6
U200
IC, Mini ABB
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Description
PartNumber
ECCH0007804
SEVY0003601
ERHZ0000402
ECCH0002002
ERHY0000275
ECCH0000151
ELCH0005001
ECCH0007803
ECCH0006201
EAN61833301
Spec
CL05A225MP5NSNC 2.2uF 20% 10V X5R -
55TO+85C 1005 R/TP 0.5MM SAMSUNG ELECTRO-
MECHANICS CO., LTD.
ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
C1005X7R1A473KT000F 47000pF 10% 10V Y5P -
30TO+85C 1005 R/TP - TDK CORPORATION
MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP -
ROHM.
CL05B472KB5NNNC 4.7nF 10% 25V X7R -
55TO+125C 1005 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
HK1005 2N2S 2.2NH 0.3NH - 300mA 0.13OHM 6GHZ
8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C
1608 R/TP 0.8MM SAMSUNG ELECTRO-
MECHANICS CO., LTD.
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK CORPORATION
LP8727 1.6V to 5.5V 0SEC 0SEC 0W 8 Mini ABB
Basic MUIC, Charger IC WL-CSP R/TP 25P
NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.
- 171 -
Copyright © 011 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes
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