LG -S367 Service Manual page 170

Level Location No.
R104,
R223,
R224,
R225,
R229,
6 R232, Resistor, Chip
R233,
R236,
R237,
R239,
R240
FB101,
FB102,
FB200,
FB201,
FB202,
6 Filter, Bead
FB203,
FB204,
FB205,
FB206,
FB207
C104,
C105, Capacitor, Ceramic,
6
C413, Chip
C414
C229,
C232, Capacitor, Ceramic,
6
C301, Chip
C306
C220,
C221,
Capacitor, Ceramic,
6 C454,
Chip
C458,
C459
C248,
Capacitor, Ceramic,
6 C250,
Chip
C412
IC, Digital Baseband
6 U100
Processor, GSM
6 S300 Socket, Card
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
ERHZ0000484
SFBH0008105
ECZH0001217
ECCH0000115
ECCH0000155
ECCH0000112
EUSY0429401
ENSY0023601
Spec
MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP -
ROHM.
BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4
ohm 0.1A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO.,
LTD.
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA
CORPORATION
PMB8815 , 281, EDGE Rx, ARM11 208MHz, NAND
booting, 2.0Mp, FMR, IC, Digital Baseband Processor
BGA R/TP 281P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.
SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP -
ALPS ELECTRIC KOREA CO., LTD.
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