Memory Module (K5L5563Caa-D770) - LG GS205 Service Manual

3.6

Memory Module (K5L5563CAA-D770)

Figure.3-6-1 K5L5563CAA-D770 FUNCTIONAL BLOCK DIAGRAM
3.6.1 FEATURES
<Common>
• Operating Temperature : -25°C ~ 85°C
• Package : 84Ball FBGA _ 8.0mm x 11.6mm x 1.2mmt 0.8mm ball pitch
<NOR Flash>
• Single Voltage, 2.7V to 3.1V for Read and Write operations
• Organization
16M x16 bit (Word mode Only)
• Fast Read Access Time : 70ns
• Page Mode Operation
8 Words Page access allows fast asychronous read
Page Read Access Time : 30ns
• Read While Program/Erase Operation
• Multiple Bank architectures (4 banks)
Bank 0: 32Mbit (32Kw x 4 and 128Kw x 15)
Bank 1: 96Mbit (128Kw x 48)
Bank 2: 96Mbit (128Kw x 48)
Bank 3: 32Mbit (32Kw x 4 and 128Kw x 15)
• OTP Block : Extra 256 word
- 128word for factory and 128word for customer OTP
• Power Consumption (typical value)
- Active Read Current: 30mA (@5MHz)
- Program/Erase Current: 25mA
- Read While Program or Read While Erase Current: 65mA
- Standby Mode/Auto Sleep Mode: 20uA
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