Introduction; Warranty Repairs And Shipping Information; General Maintenance Information; Required Equipment - Fluke 39 Service Manual

Service procedures in this chapter should be performed by
qualified personnel only. To avoid electrical shock, do not
service this product unless you are qualified to do so.

3-1. Introduction

This chapter provides handling, cleaning, disassembly, and assembly instructions.

3-2. Warranty Repairs and Shipping Information

If your Tester is still under warranty, see the warranty information at the front of this
manual for instructions on returning the unit. The list of authorized service facilities is
included in Chapter 6.

3-3. General Maintenance Information

3-4.

Required Equipment

Equipment required for calibrating, troubleshooting, and repairing the Tester is listed in
Chapter 4 (Table 4-1).
3-5.

Static-Safe Handling

All integrated circuits, including surface mounted ICs, are susceptible to damage from
electrostatic discharge (ESD). Modern integrated circuit assemblies are more susceptible
to damage from ESD than ever before. Integrated circuits today can be built with circuit
lines less than one micron thick, allowing more than a million transistors on a 1/4-inch
square chip. These submicron structures are sensitive to static voltages under 100V. This
much voltage can be generated on a dry day by simply moving your arm. A person can
develop a charge of 2,000V by walking across a vinyl tile floor, and polyester clothing
can easily generate 5,000 to 15,000V during movement against the wearer. These low
voltage static problems are often undetected because a static charge must be in the
30,000 to 40,000V range before a person will feel a shock.
Most electronic components manufactured today can be degraded or destroyed by ESD.
While protection networks are used in CMOS devices, they can only reduce, not
eliminate, component susceptibility to ESD.
ESD may not cause an immediate failure in a component; a delayed failure or "wound-
ing" effect is caused when the semiconductor's insulation layers or junctions are
punctured. The static problem is, therefore, complicated in that failure may occur
anywhere from two hours to six months after the initial damage.
Two failure modes are associated with ESD. First, a person who has acquired a static
charge can touch a component or assembly and cause a transient discharge to pass
through the device. The resulting current ruptures the junctions of a semiconductor. The
second failure mode does not require contact with another object. Simply exposing a
device to the electric field surrounding a charged object can destroy or degrade a
component. MOS devices can fail when exposed to static fields as low as 30V.
Warning
General Maintenance

Introduction

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3-3