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guidelines (IPC/EIA J-STD-001). For measurement method, refer to the industry approved technique described
in the manual IPC-TM-650, section 2.4.22.
5.3.3
Board Solder Reflow Process Recommendations
5.3.3.1
Stencil Opening Size for Solder Paste Pads on PCB
It is recommended that the stencil aperture for solder paste be kept at the same size as the land pads'. However, for
the nine (or eight) pads at each corner of the ASIC package, the size of the openings should not exceed 400µm (see
Figure 5-3
below). This recommendation is based on AMD's sample land pattern design for the RS780E, which is
available from your AMD CSS representative.
1:1 ratio to pad, or
400µm max for the nine
corner balls' openings
1:1 ratio to pad, or
400µm max for the nine
corner balls' openings
Figure 5-3 Recommended Stencil Opening Sizes for Solder Paste Pads on PCB
5.3.3.2
Reflow Profile
A reference reflow profile is given below. Please note the following when using RoHS/lead-free solder (SAC105/305/405
Tin-Silver-Cu):
•
The final reflow temperature profile will depend on the type of solder paste and chemistry of flux used in the SMT
process. Modifications to the reference reflow profile may be required in order to accommodate the requirements of
the other components in the application.
•
An oven with 10 heating zones or above is recommended.
•
To ensure that the reflow profile meets the target specification on both sides of the board, a different profile and oven
recipe for the first and second reflow may be required.
© 2009 Advanced Micro Devices, Inc.
Proprietary
1:1 ratio to pad,
with special
requirement for
corner balls
1:1 ratio to pad, or
400µm max for the eight
corner balls' openings
1:1 ratio to pad, or
400µm max for the nine
corner balls' openings
45732 AMD 780E Databook 3.10
5-11
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