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GS6EE / NV-GS6GC / NV-GS17E / NV-GS17EB / NV-GS17EF / NV-GS17EG / NV-GS17EP / NV-GS18E / NV-GS21E / NV-GS21EB / NV-GS21EG / NV-GS21EK / NV-GS21EP / NV-GS25GC / NV-GS25GN / NV-
28GK / NV-GS35E / NV-GS35EB / NV-GS35EG / NV-GS35EP / NV-GS35GC / NV-GS35GN / NV-GS38GK
3 PREVENTION OF
ELECTRO STATIC
DISCHARGE (ESD) TO
ELECTROSTATICALLY
SENSITIVE (ES) DEVICES
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field-effect
transistors and
following techniques should be used to help reduce the
incidence of component damage caused by electro static
discharge (ESD).
1. Immediately
component or semiconductor-equipped assembly, drain off
any ESD on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging ESD wrist strap, which should be removed for
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an antistatic solder removal device. Some solder
removal
devices
protected)" can generate electrical charge sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum
foil or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and
observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static
electricity (ESD) sufficient to damage an ES device).
semiconductor "chip"
components.
before
handling
any
not
classified
as
"antistatic (ESD
4 ABOUT LEAD FREE
SOLDER (PbF)
Distinction of PbF PCB:
PCBs (manufactured) using lead free solder will have a PbF
stamp on the PCB.
Caution:
· Pb free solder has a higher melting point than standard
solder; Typically the melting point is 50-70°F (30-40°C)
higher.
Please use a high temperature soldering iron. In case of
the soldering iron with temperature control, please set it
The
to 700±20°F (370±10°C).
· Pb free solder will tend to splash when heated too high
(about 1100°F/600°C).
When soldering or unsoldering, please completely remove all
semiconductor
of the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until it melts enough.
7
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