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Printed Wiring Board - Sony ICD-55 Service Manual

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ICD-55
4-2.

PRINTED WIRING BOARD

• Semiconductor
Location
Ref. No. Location
D101
B-9
D102
B-8
D501
E-2
D502
E-3
D503
A-8
D504
C-4
D701
E-4
IC101
B-3
IC102
F-3
IC103
C-9
IC104
B-4
IC501
E-2
IC502
E-2
IC503
D-2
IC504
D-3
IC505
F-3
IC701
D-8
IC702
F-8
IC703
E-4
IC705
E-9
IC706
D-9
Q103
B-3
Q104
B-8
Q105
B-4
Q106
F-2
Q107
F-9
Q108
F-3
Q109
G-3
Q150
F-2
Q502
D-2
Q505
B-3
Q506
D-4
Q507
D-3
Q508
E-8
Q701
F-2
Q702
F-2
Q703
F-2
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
: Through hole.
®
: internal component.
¢
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• This board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in the diagram.
– 9 –
– 10 –

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