Table of Contents
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TABLE OF CONTENTS
1.
2.
Setting up the base phone ............................................... 4
Preparing the battery pack .............................................. 4
Making calls .................................................................... 5
Receiving calls ................................................................ 6
One-touch dialing ............................................................ 6
Speed dialing ................................................................... 7
Phone directory ............................................................... 7
Switching the phones during a call ................................. 8
Talking between the phones (Intercom) ......................... 8
Voice paging .................................................................... 9
Transferring a call ........................................................... 9
3.
......................................................... 10
4.
4-1. Access Method ................................................................ 13
4-2. Protocol ........................................................................... 13
5.
5-1. Base Unit Section ............................................................ 16
5-2. Handset Section ............................................................... 17
5-3. RF Testing ....................................................................... 18
6.
6-1. Base Unit Section ............................................................ 20
6-2. Handset Section ............................................................... 21
7.
7-1. Block Diagram - BASE UNIT Section - ....................... 25
7-2. Block Diagram - HANDSET Section - ......................... 27
and Schematic Diagrams ................................................ 29
7-4. Printed Wiring Board
BASE MICROPHONE Board - ..................................... 31
- BASE MAIN Board (Side B) - ................................... 33
7-6. Schematic Diagram - BASE MAIN Section (1/3) - ...... 35
7-7. Schematic Diagram - BASE MAIN Section (2/3) - ...... 37
7-8. Schematic Diagram - BASE MAIN Section (3/3) - ...... 39
7-9. Printed Wiring Board - BASE KEY Section - ............. 41
7-10. Schematic Diagram - BASE KEY Section - ................ 42
7-11. Printed Wiring Board - HAND MAIN Section - ......... 43
7-12. Schematic Diagram - HAND MAIN Section - ............ 45
7-13. IC Pin Function Description ........................................... 48
8.
9.
............................................... 3
................................................ 53
............................... 55
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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