Sony SPP-SS964 Service Manual
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Sony SPP-SS964 Service Manual

Sony SPP-SS964 Service Manual

Cordless telephone
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SPP-SS964
SERVICE MANUAL
E Model
SPECIFICATIONS
AC power adaptor (AC-T46)
Telephone line cord
Wall bracket/stand for base phone
Rechargeable battery pack (BP-T24)
Directories
CORDLESS TELEPHONE
MICROFILM

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  • Page 1 SPP-SS964 SERVICE MANUAL E Model SPECIFICATIONS AC power adaptor (AC-T46) Telephone line cord Wall bracket/stand for base phone Rechargeable battery pack (BP-T24) Directories CORDLESS TELEPHONE MICROFILM...

  • Page 2: Table Of Contents

    AND IN THE PARTS LIST ARE CRITICAL TO SAFE Receiving calls ..............6 OPERATION. REPLACE THESE COMPONENTS WITH One-touch dialing ............6 SONY PARTS WHOSE PART NUMBERS APPEAR AS Speed dialing ..............7 SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- Phone directory ............... 7 LISHED BY SONY.

  • Page 3: Servicing Notes

    SECTION 1 SERVICING NOTES CABLE FASTENING METHOD • TDD noise may be generated in the intercom or handset speech depending on how the cables are fastened, and therefore fasten the cables as shown below. 1 Erect the cabinet (upper) 90 degrees. 2 Insert the wires in the ribs at A and B.

  • Page 4: General

    SECTION 2 This section is extracted from instruction manual. GENERAL – 4 –...
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  • Page 10: Disassembly

    SECTION 3 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. • HANDSET REAR CABINET 2 two screws (BTP 2.6 × 10) 1 Remove the battery case lid to direction of the arrow A . 3 two claws 4 claw 5 Remove the rear cabinet to direction of the arrow B .
  • Page 11 HAND MAIN BOARD 1 connector 2 four screws 3 screw (CN401) (P3 × 16) (BTP2.6 × 8) 1 connector (CN302) 3 three screws (BTP2.6 × 8) 4 Removal of the HAND MAIN board direction of the arrow A . – 11 –...
  • Page 12 • BASESET BASESET (UPPER) ASS’Y 3 baseset (upper) ass’y 2 two claws 1 two screws 1 two screws (P3 × 12) (P3 × 12) BASE MAIN BOARD 5 BASE MAIN board 3 four screws (BTP2.6 × 8) 4 four screws (P3 ×...

  • Page 13: 900 Mhz System Operation

    SECTION 4 900 MHz SYSTEM OPERATION 4-1. ACCESS METHOD 4-2. PROTOCOL 1. General 1. Transfer format & rate This system realizes the TX/RX superframe by TDD system. The The transfer format & rate of our system is as follows; relation of master/slave dose not decide identification regarding the protocol between BS and HS, but the initiated side is the mas- Table 4-1.
  • Page 14 4. Stand-by Mode Operation (1) HS When the HS is the stand-by mode (sleep mode), the HS do the intermittent operation for power save, because the HS is the battery operation. This process of stand-by mode operation is as follows. 10 sec 10 sec Heart-Beat...
  • Page 15 5. Link Establishment Master Slave According to the following Fig. 4-1, the requested side for link establishment is the master. The system have to exchange the A-Frame for link establishment, and each system ID should be the same ID, and then the system A-Frame link is established.

  • Page 16: Test Mode

    SECTION 5 TEST MODE 5-1. BASE UNIT SECTION E) Loopback test group 1 [Start-up] Command Mode/Operation [DIAL MODE] 1. Set the switch to the P (PULSE) side. 3-1-# CODEC Forward Loopback (L1) [INTERCOM] 2. Keeping the button pressed, turn the power on. (Speech path: Talk status) [DIAL MODE] 3.

  • Page 17: Handset Section

    J) Loopback test group 2 F) TDD test group 1 Command Mode/Operation Command Mode/Operation 8-1-# ADPCM Forward Loopback 4-1-# CH1 TDD mode (Master timing, Power High) status (Speech path: Intercom status) 4-2-# CH1 TDD mode (Master timing, Power Mid) status (MIC IN →...

  • Page 18: Rf Testing

    5-3. RF TESTING • Transmission Wave: This test is for checking the RF system without disassembling the ATTEN 10 dB –16.00 dBm 0 dBm 10 dB/ 903.392 MHz set in servicing. Perform measurement using the spectrum ana- lyzer and jig antenna. 5-3-1.
  • Page 19 • Measurement: Measure peak level by Spectrum analyzer. 903.587 MHz –5 .0 dBm AT 10 dB –3.67 dBm PEAK –6 –1 –4 –7 18dB –3 –2 PLOTTER ADRS –8 –9 WA SB SC FC CORR Fig. 4 CENTER 903.600 MHz SPAN 5.000 MHz RES BW 1.0 MHz...

  • Page 20: Electrical Adjustments

    SECTION 6 ELECTRICAL ADJUSTMENTS 6-1. BASE UNIT SECTION 3. Checking TX Output Setting: • Make the set in Test mode (see page 16) peak power meter 1. Checking RX I & Q Output Level Setting: ANTENNA TERMINAL – oscilloscope level meter Procedure: TP906: RXIP 1.

  • Page 21: Handset Section

    6-2. HANDSET SECTION 3. Checking TX output Setting: • Make the set in Test mode (see page 17) peak power meter 1. Checking RX I & Q Output Level Setting: ANTENNA TERMINAL – oscilloscope level meter TP520: RXIP Procedure: TP521: RXIN 1.
  • Page 22 Adjustment Location: ANTENNA TERMINAL [BASE MAIN board] : Checking RX I & Q Output level SW951 frequency counter : Checking TX Center Frequency (Side B) T ˜ P peak power meter : Checking TX Output TP919: GND TP918 and TP919 short : Checking TX Center Frequency TP918: TEST TP903: RXQN...
  • Page 23 [HAND MAIN board] (Side A ) ANTENNA TERMINAL : Checking RX I & Q Output level frequency counter : Checking TX Center Frequency peak power meter : Checking TX Output TP553: GND TP555 and TP553 short : TP555: TEST Checking TX Center Frequency CN501 TP523: RXQN TP522: RXQP...

  • Page 24: Diagrams

    SPP-SS964 SECTION 7 DIAGRAMS 7-1. BLOCK DIAGRAM – BASE UNIT Section – RFU901 ASIC CODEC RF UNIT IC751 IC701 LINEO LINE B.P.F. MJ101 CN901 LINE VBAT (FOR RX) ANT901 SPKPO DATAI 16 BIT MODULATOR & TELESCOPIC SPEAKER RXIP RXIP CDCDATAO 25...

  • Page 25: Block Diagram - Handset Section

    SPP-SS964 7-2. BLOCK DIAGRAM – HANDSET Section – • SIGNAL PATH RFU501 ASIC CODEC : RX RF UNIT IC501 IC401 LINEO BUZZER DRIVE BZ401 LINE Q502 (BUZZER) : TX CN501 : BELL VBAT (FOR RX) SPKPO DATAI 16 BIT MODULATOR &...

  • Page 26: Notes For Printed Wiring Boards

    SPP-SS964 7-3. NOTES FOR PRINTED WIRING BOARDS • Waveforms – BASE MAIN Board – – HAND MAIN Board – AND SCHEMATIC DIAGRAMS Note on Printed Wiring Board: Note on Schematic Diagram: 1 IC751 (¶ (XTALI) 1 IC501 (¶ (XTALI) • X : parts extracted from the component side.
  • Page 27 SPP-SS964 7-4. PRINTED WIRING BOARDS – BASE MAIN Board (Side A)/BASE MICROPHONE Board – • Semiconductor Location (SIDE A) Ref. No. Location IC602 IC701 IC751 IC951 Q208 Q209 F-10 Q210 F-11 Q211 F-10 (Page 33) (Page – 31 – – 32 –...

  • Page 28: Printed Wiring Board - Base Main Board (Side B)

    SPP-SS964 7-5. PRINTED WIRING BOARD – BASE MAIN Board (Side B) – • Semiconductor Location (SIDE B) Ref. No. Location D100 D102 B-11 D103 A-11 D104 C-11 D105 A-10 D106 A-10 D107 B-10 D108 B-10 D110 D601 D602 D603 D652...

  • Page 29: Schematic Diagram – Base Main Section (1/3)

    SPP-SS964 7-6. SCHEMATIC DIAGRAM – BASE MAIN Section (1/3) – • See page 30 for Waveform. • See page 47 for IC Block Diagrams. (Page 37) (Page 42) (Page 39) (Page 39) – 35 – – 36 –...

  • Page 30: Schematic Diagram – Base Main Section (2/3)

    SPP-SS964 7-7. SCHEMATIC DIAGRAM – BASE MAIN Section (2/3) – • See page 47 for IC Block Diagrams. (Page (Page 39) – 37 – – 38 –...

  • Page 31: Schematic Diagram – Base Main Section (3/3)

    SPP-SS964 7-8. SCHEMATIC DIAGRAM – BASE MAIN Section (3/3) – • See page 47 for IC Block Diagrams. (Page 37) (Page (Page 35) – 39 – – 40 –...

  • Page 32: Printed Wiring Board - Base Key Section

    SPP-SS964 7-9. PRINTED WIRING BOARD – BASE KEY Section – 7-10. SCHEMATIC DIAGRAM – BASE KEY Section – (Page 35) (Page 31) Note • b : Pattern of the side which is seen. (Carbon pattern) • : Pattern from the side which enables seeing.

  • Page 33: Printed Wiring Board - Hand Main Section

    SPP-SS964 7-11. PRINTED WIRING BOARD – HAND MAIN Section – • Semiconductor Location (SIDE A) Ref. No. Location D502 D503 Q501 Q504 Q505 Note: • Y : carbon pattern • Semiconductor Location (SIDE B) Ref. No. Location D301 B-11 D302...

  • Page 34: Schematic Diagram – Hand Main Section

    SPP-SS964 7-12. SCHEMATIC DIAGRAM – HAND MAIN Section – • See page 30 for Waveform. • See page 47 for IC Block Diagrams. – 45 – – 46 –...

  • Page 35: Ic Pin Function Description

    • IC Block Diagrams 7-13. IC PIN FUNCTION DESCRIPTION • HAND MAIN BOARD IC501 M7012-11 (ASIC) IC103 MC34118DW (BASE MAIN BOARD) IC104 MC34119DR2 (BASE MAIN BOARD) Pin No. Pin Name Function KEYPADB5 Key output terminal Not used (open) Selection input of the model Fixed at “L” in this set VREF 3, 4 D1, D2...
  • Page 36 Pin No. Pin Name Function IBIAS Analog bias input terminal AGND — Analog ground terminal BATTERY Battery voltage detection input terminal Not used (open) Auto gain control signal output to the RF unit CALLER-ID Not used (open) PARKP Charge detection input terminal “L”: charge on VDDC —...
  • Page 37 • BASE MAIN BOARD IC751 C7311-11 (ASIC) Pin No. Pin Name Function KEY-OUT5 Key output terminal Not used (open) Selection input of the model (fixed at “L” in this set) 3, 4 D1, D2 Not used (open) Not used (open) 6 to 9 D4 to D7 Not used (open)
  • Page 38 Pin No. Pin Name Function RXQN Receive data (Q negative) input from the RF unit — Not used (open) IBIAS Analog bias input terminal AGND — Analog ground terminal POWERDOWN Battery voltage detection input terminal “L”: power down AFC (BEEP) Beep tone signal output terminal Auto gain control signal output to the RF unit MT-CLK...
  • Page 39 Pin No. Pin Name Function XTALI Main system clock input terminal (9.6 MHz) XTALO Main system clock output terminal (9.6 MHz) VDDP — Power supply terminal (+5V) (for pad) VSSP — Ground terminal (for pad) – 52 –...

  • Page 40: Exploded Views

    SECTION 8 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they may have some difference from the original are seldom required for routine service. Some one. delay should be anticipated when ordering •...
  • Page 41 (2) BASESET SECTION supplied SP101 ANT901 RFU901 supplied Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 51 1-671-562-11 BASE KEY BOARD * 63 A-3622-274-A BASE MAIN BOARD, COMPLETE 1-771-364-11 SWITCH, RUBBER KEY (BASE) 3-029-168-01 SHEET (COPPER LEAF. RF) (B) 3-024-958-01 BUTTON (12 KEY) 3-030-066-01 SHEET (COPPER LEAF.

  • Page 42: Electrical Parts List

    BASE KEY BASE MAIN SECTION 9 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they The components identified by mark ! or dotted line with mark are seldom required for routine service. parts list may be different from the parts speci- ! are critical for safety.
  • Page 43 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C261 1-163-235-11 CERAMIC CHIP 22PF C608 1-164-505-11 CERAMIC CHIP 2.2uF C609 1-126-963-11 ELECT 4.7uF C262 1-163-239-11 CERAMIC CHIP 33PF C611 1-163-033-00 CERAMIC CHIP 0.022uF C267 1-163-235-11 CERAMIC CHIP 22PF C612 1-163-033-00 CERAMIC CHIP...
  • Page 44 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark D106 8-719-970-02 DIODE 1SR139-400 L202 1-414-481-11 INDUCTOR 68nH D107 8-719-970-02 DIODE 1SR139-400 L601 1-410-468-11 INDUCTOR 6.8uH D108 8-719-970-02 DIODE 1SR139-400 D110 8-719-160-55 DIODE RD12F-B1 L602 1-410-468-11 INDUCTOR 6.8uH D601 8-719-109-57 DIODE RD2.4ES-B2...
  • Page 45 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R154 1-216-085-00 METAL CHIP 1/10W R260 1-216-097-00 RES,CHIP 100K 1/10W R201 1-216-097-00 RES,CHIP 100K 1/10W R202 1-216-093-00 RES,CHIP 1/10W R261 1-216-109-00 METAL CHIP 330K 1/10W R203 1-216-049-11 RES,CHIP 1/10W R262...
  • Page 46 BASE MAIN BASE MICROPHONE HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R703 1-216-009-00 RES,CHIP 1/10W R914 1-216-041-00 METAL CHIP 1/10W R704 1-216-081-00 METAL CHIP 1/10W R705 1-216-025-00 RES,CHIP 1/10W R954 1-216-073-00 METAL CHIP 1/10W R706 1-216-041-00 METAL CHIP...
  • Page 47 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < CAPACITOR > < DIODE > 1-163-239-11 CERAMIC CHIP 33PF D301 8-719-938-75 DIODE SB05-05CP 1-163-239-11 CERAMIC CHIP 33PF D302 8-719-938-75 DIODE SB05-05CP 1-163-239-11 CERAMIC CHIP 33PF D303 8-719-938-75 DIODE SB05-05CP 1-163-235-11 CERAMIC CHIP...
  • Page 48 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-164-344-11 CERAMIC CHIP 0.068uF R542 1-216-296-00 SHORT 1-216-097-00 RES,CHIP 100K 1/10W 1-414-481-11 INDUCTOR 68nH R544 1-216-817-11 METAL CHIP 1/16W 1-216-065-00 RES,CHIP 4.7K 1/10W R545 1-216-805-11 METAL CHIP 1/16W R546 1-216-821-11 METAL CHIP...
  • Page 49 SPP-SS964 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark ************** HARDWARE LIST ************** 7-685-650-79 SCREW +P 3X16 TYPE2 NON-SLIT 7-685-135-19 SCREW +BTP 2.6X10 TYPE2 N-S 7-685-134-19 SCREW +BTP 2.6X8 TYPE2 N-S 7-685-648-79 SCREW +P 3X12 TYPE2 NON-SLIT ************************************************************ ACCESSORIES &...

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