Toshiba MCY-MHP0404HT-C Service Manual page 170

Comp-IPDU P.C.board
(43H69013)
Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
P.C.board
Screw (M3x20)
Used to secure the IGBT and rectifiers
Screw tightening torque: 0.55 ±0.1 N•m
Single-touch spacer
Screw
(M4x14)
First remove the
screws , and then
remove the P.C.
board assembly.
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM , IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM , IGBT and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
169
Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
Single-touch spacer
Screw (M4x14)
Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N•m
Screw (M4x8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
Screw (M4x15)
Used to secure the rectifiers
Screw tightening torque: 1.2 ±0.1 N•m
Card spacer