Sony HCD-XB8 Service Manual page 2

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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
— 2 —
MODEL IDENTIFICATION
— BACK PANEL —
Parts No.
PARTS No.
MODEL
AEP, UK model 4-987-045-0
EE, CIS model 4-987-045-2
E, AR, SAF model 4-988-222-0
AUS model 4-988-222-1
PX model 4-988-222-2
MX model 4-988-222-3
• Abbreviation
AUS: Australian model
AR : Argentine model
SAF : South Africa model
MX : Mexican model
EE : East European model
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