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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
R339
C329
No.MA468
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
R345
C337
R346
R317
C336
R344
R342
R337
R316
R302
R305
C305
R309
R310
(No.MA468<Rev.001>)18/21
<Mecha control board>
R503
created date:2010-02-05
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