<LED board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
No.MA468
created date:2010-02-05
(No.MA468<Rev.001>)14/21
