(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
X101
IC101
R104
R104
R105
R105
C181
C180
R160
R160
R161
R163
R165
R163
R165
TP101
TP102
TP103
TP104
RA111
CN101
No.MA468
CN102
RA101
RA102
RA103
C114
RA101
RA103
RA102
C126
C198
C126
#PC00107
RA110
(No.MA468<Rev.001>)16/21
<HD board>
1P1B
S1B
created date:2010-02-05