2. Safety Instructions, Warnings, and Notes
Safety regulations require that during a repair:
Connect the set to the mains via an isolation transformer
(> 800 VA).
Do not operate the monitor without the front glass plate.
One function of this glass plate is to absorb IR radiation.
Without this glass plate, the level of radiation could
damage your eyes.
Replace safety components, indicated by the symbol
only by components identical to the original ones.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay, in particular, attention to
the following points:
Route the wire trees correctly and fix them with the
mounted cable clamps.
Check the insulation of the mains lead for external
Check the electrical DC resistance between the mains plug
and the secondary side (only for sets which have a mains
isolated power supply):
1. Unplug the mains cord and connect a wire between the
two pins of the mains plug.
2. Set the mains switch to the 'on' position (keep the
mains cord unplugged!).
3. Measure the resistance value between the pins of the
mains plug and the metal shielding of the tuner or the
aerial connection on the set. The reading should be
between 4.5 MΩ and 12 MΩ.
4. Switch 'off' the set, and remove the wire between the
two pins of the mains plug.
Check the cabinet for defects, to avoid touching of any
inner parts by the customer.
All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential.
Available ESD protection equipment:
Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822
Wristband tester 4822 344 13999.
Be careful during measurements in the high voltage
Never replace modules or other components while the unit
is switched 'on'.
When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a
circuit becoming unstable.
Clean the glass plate in front of the plasma display with a
slightly humid cloth. If, due to circumstances, there is some
dirt between the glass plate and the plasma display, this
must be cleaned by a qualified service engineer (see
section "Mechanical Instructions").
Measure the direct voltages and oscillograms with regard
to the chassis ground (), or hot ground () as this is
The direct voltages and oscillograms shown in the
diagrams are indicative. Measure them in the Service
Default Mode (see section "Service Modes").
Safety Instructions, Warnings, and Notes
Where necessary, measure the voltages in the power
supply section both in normal operation () and in standby
(). These values are indicated by means of the
The semiconductors indicated in the circuit diagram and in
the parts lists, are interchangeable per position with the
semiconductors in the unit, irrespective of the type
indication on these semiconductors
All resistor values are in ohms and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kOhm).
Resistor values with no multiplier may be indicated with
either an 'E' or an 'R' (e.g. 220E or 220R indicates 220
All Capacitor values are expressed in Micro-Farads (µ =
), Nano-Farads (n = x10
Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
An 'asterisk' (*) indicates component usage varies. Refer to
the diversity tables for the correct values.
The correct component values are listed in the Electrical
Replacement Parts List. Therefore, always check this list
when there is any doubt.
Rework on BGA ICs
Although (LF)BGA assembly yields are very high, there may
still be a requirement for component rework. By rework, we
mean the process of removing the component from the PWB
and replacing it with a new component. If an (LF)BGA is
removed from a PWB, the solder balls of the component are
deformed drastically so the removed (LF)BGA has to be
As is the case with any component, it is essential when
removing an (LF)BGA that the board, tracks, solder lands, or
surrounding components are not damaged. To remove an
(LF)BGA, the board must be uniformly heated to a temperature
close to the reflow soldering temperature. A uniform
temperature reduces the chance of warping the PWB.
To do this, we recommend that the board is heated until it is
certain that all the joints are molten. Then carefully pull the
component off the board with a vacuum nozzle. For the
appropriate temperature profiles, see the IC data sheet.
When the component has been removed, the vacant IC area
must be cleaned before replacing the (LF)BGA.
Removing an IC often leaves varying amounts of solder on the
mounting lands. This excessive solder can be removed with
either a solder sucker or solder wick. The remaining flux can be
removed with a brush and cleaning agent.
After the board is properly cleaned and inspected, apply flux on
the solder lands and on the connection balls of the (LF)BGA.
Note: Do not apply solder paste, as this has shown to result in
problems during re-soldering.
), or Pico-Farads (p = x10