QSC RMX 850 Technical & Service Manual page 7

Solder
Figure 1.3.
Tweezers
Figure 1.4.
Solder
Figure 1.5.
Solder
Figure 1.6.
Insertion
1 With a soldering iron and 60/40 or 63/37 eutectic-type solder, melt just enough solder onto one pad to create a small mound of solder.
2 Grasp the component with tweezers. Melt the small mound of solder with the iron and place the component in the correct orientation
across the three pads and press it flat against the circuit board, with one terminal of the component pressed into the melted solder.
3 Hold the component in place and take the soldering iron away. Let the solder harden to tack the component in place.
4 Fully solder the other terminals of the component to their pads. Let the solder harden.
5 Fully solder the tacked terminal of the component to its pad.
Multi-pin components (ICs, etc.)
Removal
Removing a multi-pin SMT component is a delicate procedure. Ideally, you should use a soldering iron with an attachment that allows you to
heat all the pins simultaneously.
If such a soldering device is not available, use this procedure:
1 Use a soldering iron and solder braid to remove as much solder as possible from the pins of the component.
2 With fine tweezers, carefully try to lift each pin to see if it's free. If it's not, touch it with the tip of the soldering iron and if necessary, use
the solder braid to remove the remaining solder.
3 Repeat the process until all the pins are free and you can remove the component.
Insertion
1 With a soldering iron and 60/40 or 63/37 eutectic-type solder, melt just enough solder onto one pad to create a small mound of solder. It
is usually easiest to use a pad that corresponds to one of the end or corner pins of the component.
2 Grasp the component with tweezers. Melt the small mound of solder with the iron and place the component in the correct orientation
upon its pads and gently press it flat against the circuit board, with the appropriate terminal of the component pressed into the melted
solder.
3 Hold the component in place and take the soldering iron away. Let the solder harden to tack the component in place.
4 Fully solder the other terminals of the component to their pads. Let the solder harden.
5 Fully solder the tacked terminal of the component to its pad.
RMX Series Technical Service Manual
Insertion
1 With a soldering iron and 60/40 or 63/37 eutectic-type solder, melt just enough solder onto one pad to
create a small mound (Figure 1.3).
2 Grasp the component in the middle with tweezers. Melt the small mound of solder with the iron and
place the component across the two pads (in the correct orientation, if the component is sensitive to
direction) and press it flat against the circuit board, with one end of the component immersed in the
melted solder (Figure 1.4).
3 Hold the component in place and take the soldering iron away. Let the solder harden to tack the
component in place.
4 Fully solder the other end of the component to its pad. Let the solder harden (Figure 1.5).
5 Fully solder the tacked end of the component to its pad (Figure 1.6).
Three-terminal components (transistors, etc.)
Removal
1 With a soldering iron and solder braid, remove as much solder as possible from the middle terminal of
the component.
2 With a soldering iron in each hand, hold one tip on the solder at the terminal at one end of the compo-
nent and the other tip on the terminal at the other end.
3 When the solder on both ends melts, grip the component between the two tips and lift it from the circuit
board. You might need to quickly touch the pad on the middle terminal with a soldering iron to melt any
remaining solder that might be holding the component down.
4 Use solder braid and a soldering iron to remove the solder from the three pads.
5