HP PAVILION 311 Maintenance And Service Manual page 85

✎
Step 3 applies to HP Pavilion computer models. See Step 2 for HP Mini and Compaq Mini Computer models.
3. Remove the heat sink assembly 2.
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the fan and heat sink are removed:
Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■
Thermal pads are used on the Intel GS45 (8W) chip 3 and the heat sink section 4 that services it.
■
Thermal pads are used on the Southbridge ICH9M chip 5 and the heat sink section 6 that services it.
■
Replacement thermal material is included with all system board and heat sink assembly spare part kits.
Reverse this procedure to install heat sink.
Maintenance and Service Guide
Removal and replacement procedures
4–45