X3630 M3 Specifications - IBM System x3630 M3 Specification

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Machine type
Form factor
Processor types (standard or via CTO)
Maximum processor power draw
QuickPath Interconnect (QPI) speed
(gigatransfers per second)
# of processors standard / maximum
Hyper Threading Technology supported
Turbo Boost Technology supported
Internal L3 cache
Chipset
BIOS type
7
Standard memory
(96GB maximum)
# of DIMM sockets total / available
Memory voltage standard
Memory type standard
Maximum memory access speed
Memory interleaving
DIMM types / capacities supported
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IBM System x3630 M3 Specifications
7377-22x, 32x, 42x, 52x, 62x/64x, 72x, A2x, B2x, C2x, D2x, F2x, G2x
6-Core Xeon
(E56xx/L56xx/X56xx)
2.26GHz L5640 (CTO),
2.4GHz E5645 (D2x),
2.53GHz E5649 (F2x),
2.66GHz X5650
(62x/64x),
2.8GHz X5660 (CTO),,
2.93GHz X5670 (72x);
3.06GHz X5675 (G2x)
95W—62x/64x,
72x, G2x, plus
X5660/X5672 via
CTO
6.4GTps
(62x/64x, 72x, G2x, plus
X5660/X5672 via CTO)
Yes (2 threads per core) — 42x, 52x,
62x/64x, 72x, C2x, D2x, F2x, G2x, plus
L5630/L5640 via CTO
Yes — 42x, 52x, 62x, 72x, C2x, D2x,
F2x, G2x, plus L5630/L5640 via CTO
12MB (1 shared 12MB
cache)—42x, 52x, 62x/
64x, 72x, C2x, D2x, F2x,
G2x, plus E5620, L5630,
L5640 via CTO
Unified Extensible Firmware Interface (UEFI)
12GB (3 x 4GB) — 62x, 72x
12 / 9 — 62x, 72x
1.5V (22x, 32x, 42x, 52x, 62x, 72x, CTO)
Registered PC3-10600 (DDR III ECC
(Chipkill protection standard)—Dual-
rank x4 (22x, 32x, 42x, 52x, 62x, 72x,
CTO)
1333MHz (62x/64X, 72x,
G2x, plus X5660 via CTO)
PC3-10600
1333MHz RDIMM
1GB single-rank x8, 1.5V;
2U
4-Core Xeon
(E56xx/L56xx/56xx)
1.6GHz E5603 (A2x),
1.86GHz L5609 (CTO),
2.13GHz E5606 (CTO),
2.13GHz L5630 (CTO),
2.26GHz E5607 (B2x),
2.4GHz E5620 (C2x),
2.53GHz E5630 (42x),
2.66GHz E5640 (52x),
3.2GHz X5672 (CTO)
80W—all other
models, plus
60W—L5640 via
E5503, E5606/
CTO
E5630 via CTO
5.86GTps
(42x, 52x, C2x, D2x, F2x,
plus L5630/L5640 via
CTO)
1 / 2
No — 22x, 32x, A2x, B2x, E5503, plus
E5606, L5609 via CTO
No — 22x, 32x, A2x, B2x, plus E5503,
E5606, L5609 via CTO
8MB (1 shared 8MB
cache)—B2x, plus E5606
via CTO
Intel 5520
4GB (1 x 4GB) — 22x, 32x, 42x, 52x,
64x, A2x, B2x, C2x, D2x, F2x G2x
12 / 11 — 22x, 32x, 42x, 52x
1.35V (64x, A2x, B2x, C2x, D2x, F2x,
Registered PC3-10600 (DDR III ECC
(Chipkill protection optional)—Single-
rank x4 (64x, A2x, B2x, C2x, D2x, F2x,
1066MHz (42x, 52x, C2x,
D2x, F2x, plus
L5609/L5630/L5640 via
CTO)
Yes (two-way using pairs of DIMMs)
8
PC3L-10600
1333MHz RDIMM
2GB dual-rank x8 1.35V;
4-Core Xeon (E55xx)
2.13GHz E5506 (22x),
2.26GHz E5507 (32x)
2-Core Xeon (E55xx)
2.0GHz E5503 (CTO),
40W—
L5609/L5630 via
CTO
4.8GTps
(22x, 32x, A2x, B2x, plus
E5503/E5606, L5609 via
CTO)
4MB (1 shared 4MB
cache)—22x, 32x, plus
E5503, E5603 via CTO
G2x, CTO)
G2x, CTO)
800MHz (22x, 32x, plus
X5503 via CTO)
PC3L-8500R
1066MHz RDIMM
8GB dual-rank x4 1.35V
15

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