Safety-Related Component Warning - Sony HCD-RG55 Service Manual

Compact disc deck receiver
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HCD-RG55/RG55S
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Frequency response
2 Hz – 20 kHz (±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
–18 dBm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassette
Wow and flutter
±0.15% W.Peak (IEC)
0.1% W.RMS (NAB)
±0.2% W.Peak (DIN)
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
European and Middle Eastern models:
531 – 1,602 kHz (with the
interval set at 9 kHz)
Other models:
531 – 1,602 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency 450 kHz
2
General
Power requirements
European model:
230 V AC, 50/60 Hz
Australian models:
230 – 240 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Argentine models:
220 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
Other models:
120 V, 220 V or 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European models:
HCD-RG55S:
150 watts
0.5 watts (at the Power
Saving Mode)
Other models:
HCD-RG55:
200 watts
Dimensions (w/h/d)
Approx. 280 × 325 × 421 mm
Mass
HCD-RG55S:
Approx. 9.0 kg
HCD-RG55:
Approx. 10.0 kg
Supplied accessories:
AM loop antenna (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change without
notice.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

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