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General Information
3. DDR3 SDRAM Module Ordering Information
1
2
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71 : x64 204pin Unbuffered SODIMM
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
4. DRAM Component Type
B : DDR3 SDRAM (1.5V VDD)
5. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G :
1G
2G :
2G
6. # of Banks in comp. & Interface
7 :
8Banks & SSTL-1.5V
7. Bit Organization
0 : x 4
3 : x 8
4 : x16
3
4
5
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
2K : 2G (for 2Gb)
6
7
8
9
10
8. Component Revision
:
M
1st Gen.
:
B
3rd Gen.
:
D
5th Gen.
F : 7th Gen.
9. Package
:
Z
FBGA(Lead-free)
:
H
FBGA(Lead-free & Halogen-free)
:
J
FBGA(Lead-free, DDP)
:
M
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
11. Temp & Power
C
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
L
: Commercial Temp.( 0°C ~ 85°C) & Low Power
Y
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
12. Speed
F7
: DDR3-800
(400MHz @ CL=6, tRCD=6, tRP=6)
F8
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
H9
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
K0
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
DDR3 SDRAM
11
12
Component Revision
:
A
2nd Gen.
:
C
4th Gen.
:
E
6th Gen.
:
G
8th Gen.
1 : 1st Rev.
3 : 3rd Rev.
December 2008
Speed
Temp & Power
PCB Revision
Package
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