Sony HCD-HDX265 Service Manual page 8

HCD-HDX265/HDX266/HDX267W/HDX465/HDX466/HDX665
MAIN BOARD SERVICE POSITION
IO board
insulation sheet
back panel
HARNESS SETTING
Check not touch
the heat sink.
8
flexible wire
lead pin
1 Remove the back panel with IO board .
2 Remove the MAIN board.
3 Assemble the MAIN board to back panel block.
4 Reverse the back panel block.
MAIN board
lead pin
Check not touch the heat sink.
Check not touch the chassis.