XR900 Series Mass Storage Subsystem User’s Manual MCPIOSA/UM2...
Motorola, Inc. assumes no liability resulting from any omissions in this document, or from the use of the information obtained therein. Motorola reserves the right to revise this document and to make changes from time to time in the content hereof without obligation of Motorola to notify any person of such revision or changes.
To use this manual, you may need to be familiar with the publications listed in the Related Documentation section in Chapter 1 of this manual. If any modiﬁcations are made to an XR900 Series chassis, the modiﬁer assumes responsibility for radio frequency interference issues. If any payload installed in a Modular System (including the XR900 enclosure) is not totally supported by Motorola, the integrator assumes responsibility for radio frequency interference.
Motorola, Inc. assumes no liability for the customer's failure to comply with these requirements. The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. You, as the user of the product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to WARNING provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
Contents CHAPTER 1 General Information Introduction ........................1-1 General Description ....................... 1-1 Modular Chassis ...................... 1-1 XR900 Enclosure ...................... 1-2 Expansion Chassis ................... 1-3 Power Supply ....................1-3 SCSI Backplane ....................1-4 Safety and Regulatory Compliance ..............1-7 Related Documentation ..................
Power Supplies ....................3-3 Other Subassemblies ..................3-4 Assemblies Monitored ..................3-4 Voltage Monitoring Function ................3-4 Recovery ........................3-5 Operating Procedures ....................3-5 Recommended Power-On Procedure ............... 3-5 XR900 Power Control ..................3-7 Remote interface ....................3-8 Recommended Power-Off Procedure ...............
Figure 2-6. DC Terminal Block..................2-12 Figure 4-1. Bezel Removal .................... 4-3 Figure 4-2. Side Panel Removal ..................4-5 Figure 4-3. Power Supply Removal ................4-7 Figure 4-4. Drive Module Release Latches..............4-10 Figure 5-1. XR900 Series Chassis .................. 5-3...
List of Tables Table 1-1. XR900 Enclosure Speciﬁcations ..............1-4 Table 1-2. XR900 Power Supply Speciﬁcations ............1-5 Table 1-3. SCSI Backplane Speciﬁcations ..............1-6 Table 2-1. Hardware Preparation Items ................ 2-2 Table 3-1. Environmental Monitor Connector Signals ..........3-8 Table 5-1.
1General Information Introduction This manual provides general information, hardware preparation and installation instructions, removal/replacement procedures, operating instructions, and support information for the XR900 series SCSI standalone peripheral expansion enclosure. Throughout the rest of this manual, this enclosure may be referred to as the XR900, or simply as the enclosure.
General Information XR900 Enclosure For base chassis that have no built-in drive bays (e.g., the 20- and dual 9-slot versions) or for applications that require additional storage capacity in a mix of 5 -inch and 3 -inch drives, integral and standalone SCSI peripheral expansion enclosures are available. The integral enclosure is described in the Modular VME System Chassis User’s Manual.
General Description data transfers and control processes, including the switching of the XR900 power supply on and off, occur under the control of the host computer. In applications involving a dual 9-slot system (Modular Note Chassis model MC1209), the XR900 chassis serves one side or the other, but not both at once.
General Information Table 1-1. XR900 Enclosure Speciﬁcations Characteristics Speciﬁcations Physical characteristics Height 5.25 in. (133 mm) Width 19.0 in. (483 mm) w/o ﬂange extensions 23.0 in. (584 mm) with ﬂange extensions Depth 13.5 in. (343 mm) with bezel Weight (fully loaded) 25 lb.
General Description Table 1-2. XR900 Power Supply Speciﬁcations Characteristics Speciﬁcations Physical characteristics Height 4.0 in. (102 mm) Width 2.4 in. (61 mm) Length 9.0 in. (229 mm) Temperature Operating 0˚ to 50˚ C (32˚ to 122˚ F) Storage and transit 55˚...
General Information Table 1-3. SCSI Backplane Speciﬁcations Characteristics Speciﬁcations Physical characteristics Height 4.1 inches (104mm) Width 11.6 inches (295mm) Thickness 0.062 inches (1.58mm) typical Temperature Operating 0˚C to 55˚C (32˚F to 131˚F) Storage and transit 55˚C to +85˚C ( 67˚F to 185˚F) Relative humidity 0% to 90% noncondensing Power consumption...
General Description Safety and Regulatory Compliance All systems integrated by Motorola meet the standards claimed for those systems with regard to electromagnetic interference (EMI) and radio frequency interference (RFI). It is possible, however, to install drives in the XR900 enclosure that produce a Modular Chassis system not in compliance with the applicable emission limits.
General Information Related Documentation The Motorola publications listed below are referenced in this document. If not shipped with this product, they may be purchased by contacting your local Motorola sales office. Non-Motorola documents may be obtained from the sources listed.
2Hardware Preparation and Installation Introduction This chapter includes hardware preparation and installation directions for the XR900 enclosure. Directions for installing or replacing the various subassemblies are in the Removal/Replacement procedures in Chapter 5. Mounting Options A Modular VME System can be rack-mounted, mast-mounted (as in a telecommunications environment) or set up in a floor-standing pedestal configuration.
Hardware Preparation and Installation Unless otherwise instructed, perform all hardware preparation and/or installation with power disconnected. Installing or removing hardware items Caution (drive modules, cables, etc.) while power is applied may damage the equipment. Table 2-1. Hardware Preparation Items Item Location of Instructions Setting jumper options on drive modules User’s manual for the respective drive module(s)
Rack/Mast Mounting 3. Determine the width of the rack or mast and, if necessary, attach a pair of mounting flanges to the sides of the chassis in the appropriate locations. Flanges for the right and left sides are identical. – For 19-inch rack mounting, use the existing flanges formed in the sheet metal at the forward corners of the chassis.
Hardware Preparation and Installation 4. Remove the side and back panels of the rack as necessary to gain access to the interior for chassis installation. The next two steps are a two-person operation. Caution 5. Position the chassis in the selected rack bay or mast location and align the slots in the chassis flanges with the corresponding holes in the frame rails of the rack or mast.
Pedestal Mounting 2. Remove the Modular Chassis pedestal cover by removing the two screws at the back edge of the cover and sliding it off the chassis. 111058.00 9410 (2-2) Figure 2-2. Pedestal Cover Removal 3. Remove the bezel from the XR900 chassis, if a bezel is installed.
Hardware Preparation and Installation – If the XR900 is to be mounted directly on a Modular Chassis enclosure, remove the bezel and side panels from that enclosure. 11064.00 9503 Figure 2-3. Side Panel Removal 5. Remove the stacking brackets from the top section of the supporting pedestal unit.
Pedestal Mounting EXPANSION CHASSIS CARD CAGE 11050.00 9503 Figure 2-4. Installing XR900 Chassis 9. Install the bezel and side panels supplied with the XR900 chassis on the XR900. 10. Install the pedestal cover removed in step 2 on the XR900.
Hardware Preparation and Installation Cabling After you have completed the rack or pedestal installation of the XR900 chassis and associated equipment, proceed as follows to cable the hardware together. Note All rack cabling should be contained within the rack bay. Cabling to external peripheral equipment should be routed through the rear panel of the rack.
Cabling with a ‘‘no telephone’’ graphic) on the back of the XR900 chassis. 5. Plug the other end of the cable into the upper RJ45 connector on the back of the existing integral SCSI peripheral expansion chassis (if one is present) or into the appropriate RJ45 control board connector on the back of the Modular Chassis.
Hardware Preparation and Installation SCSI TERMINATOR SCSI CABLE ENVIRONMENTAL MONITOR CABLE 11063.00 9409 Figure 2-5. SCSI and Environmental Monitor Connections 2-10...
Cabling Power Cables (AC Chassis) 1. Plug the socket end of the XR900 power cord into the AC power inlet located on the upper back panel. 2. Plug the socket end of the Modular Chassis power cord into the AC power inlet located on the lower back panel. 3.
Hardware Preparation and Installation Note For additional protection if the conditions of the site call for it, you may wish to also use the chassis ground point on the rear wall of the unit (the GND connection with a x 20 thread located to the right of the upper set of SCSI and RJ45 connectors).
Power Supply Limit Considerations 3. Assemble the clam-shell connector housing around the terminal block as shown in Figure 2-6. Secure a length of Tyrap around the housing to reinforce the assembly. 4. Plug the assembled connector into the DC power inlet located on the upper back panel of the XR900.
Hardware Preparation and Installation Chassis Cooling Considerations It is essential that all modules used in the system be properly cooled. The following information is supplied to help determine whether the cooling is adequate. Modular Chassis equipment, including the XR900 chassis, is designed for an input air temperature below 50 C (122 F).
XR900 chassis) turns on when the temperature sensor in the enclosure is not adequately cooled. At that point, Motorola-supported SCSI devices in the XR900 (and most other SCSI devices) are approaching their upper temperature limits but are not in danger of immediate damage.
Operating Instructions Environmental Monitor An environmental monitoring function to track enclosure temperatures and operating voltages is incorporated into the Modular Chassis system design. The extent of coverage can be specified when the equipment is ordered. In the Modular Chassis, power supply outputs and temperatures are always monitored.
VMEbus ACFAIL and the affected power supply is shut down automatically. At the lower threshold, Motorola-supported SCSI devices in the XR900 enclosure and most other SCSI devices are approaching their upper temperature limits but are not in danger of immediate damage.
Operating Instructions Other Subassemblies In other parts of the system, temperature sensors provide only the lower threshold warning. As with power supplies, a heat buildup beyond the first threshold within a monitored subassembly illuminates the warning LED on the front of the Modular Chassis. If temperatures climb further, however, no power shutdown occurs.
Operating Procedures Recovery The surest way to reset the power distribution system after a shutdown triggered by the environmental monitor is to cycle the primary power (remove and reconnect the –48Vdc or 115/230Vac input power). In systems with a redundant power supply, setting the key switch on the Modular Chassis to and back to after a thermal...
Operating Instructions If the power switch is in the position when the line Note cord is connected to a power source, the outputs of the Modular Chassis power supply cycle on immediately. 3. Verify that the Modular Chassis and the XR900 have been connected to a –48Vdc or 115/230Vac input power source (as appropriate to the installation and system configuration).
Operating Procedures XR900 Power Control When the AC or DC power cord is attached at the upper left rear corner of the chassis and connected to an appropriate power source, DC power within the enclosure is controlled during normal operation through SCSI terminator power. When the host (the Modular Chassis) is powered up, the XR900 detects the presence of signal and powers itself up in response.
Operating Instructions Remote interface The remote interface is designed to interconnect with an environmental monitor I/O port on the host computer. Each pin connection, signal mnemonic, and signal characteristic for the connector is listed in the following table. Table 3-1. Environmental Monitor Connector Signals Signal Signal Name and Description Number...
Operating Procedures Recommended Power-Off Procedure As described in the previous section, the XR900 has no power switch. The power supply cycles on and off under the control of the host computer. Powering down the Modular Chassis also powers down the XR900 chassis. Note Ensure that proper software shutdown procedures have been followed before you continue.
Operating Instructions 3-10...
4Removal/Replacement Procedures Introduction This chapter describes recommended procedures for the removal and replacement of major assemblies and/or components of the XR900 chassis. For identification and location of the assemblies and parts mentioned in these procedures, refer to the drawings and parts lists in Chapter 6.
Removal/Replacement Procedures Front Bezel The XR900 front bezel (as well as the bezels for the Modular Chassis card cage, fan trays, and power supplies) can be used in both pedestal and rack/mast chassis configurations. The bezel is a requirement for complete RFI shielding in either configuration. The 9U bezels used on the larger enclosures of a Modular Chassis system are mounted on ball studs at the bottom and latched at the top;...
Front Bezel LATCH BUTTONS (1 EACH SIDE) BEZEL LOCKS (1 EACH SIDE) 11051.00 9408 Figure 4-1. Bezel Removal...
Removal/Replacement Procedures Side Panel/Pedestal Cover The Modular Chassis pedestal configuration incorporates side panels for the various system enclosures (including the XR900 chassis) and a pedestal cover. The inner surfaces of the panels and cover are molded with slots that engage slide hooks mounted on the corresponding enclosure.
Side Panel/Pedestal Cover 11064.00 9503 Figure 4-2. Side Panel Removal Pedestal Cover Removal/Replacement The pedestal cover is mounted with the same type of hardware as the side panels, but no latch is used. Instead, two screws on the back edge near the corners hold the cover in place. The removal procedure consists of simply removing the screws, then sliding the cover backward and disengaging it from the slide hooks.
Removal/Replacement Procedures Power Supply The power supply module (Figure 5-3) is installed at the right side of the drive bays in the XR900 chassis. The power supply receives –48Vdc or 115/230Vac input power directly through its back panel. The power supply outputs are cabled to the cooling fan and to a backplane connector, which applies operating voltages from the power supply to the mass storage modules.
Power Supply 11276.00 9503 (1-2) Figure 4-3. Power Supply Removal Replacement 1. Slide the power supply module carefully into the chassis. Use firm steady pressure to seat the connector properly. 2. Tighten the captive screw that holds the module in the chassis.
Removal/Replacement Procedures Cooling Fan The DC-powered fan mounted on the power supply module provides forced-air cooling for the power supply and the mass storage drives. The suggested procedure for removal and replacement of the cooling fan is as follows: Removal 1.
3 1/2- or 5 1/4-Inch Drive Modules or 5 -Inch Drive Modules The SCSI peripheral expansion enclosure contains up to four half- height storage devices. Two bays accommodate 3 -inch devices only. The other two bays accommodate either 3 -inch or 5 -inch devices.
Removal/Replacement Procedures 11060.00 9409 Figure 4-4. Drive Module Release Latches 4-10...
3 1/2- or 5 1/4-Inch Drive Modules Replacement 1. Ensure that power to the host system is set to and the STANDBY XR900 power cord is disconnected from the AC or DC power source. 2. Note the device address setting on the drive you are replacing, and set the address switch on the new drive to the same device number.
5Support Information Introduction This chapter supplies parts lists and diagrams of the XR900 chassis. For parts lists and drawings of the mass storage drives and power supply used in this chassis, refer to their respective reference sheets or contact the vendor (manufacturer) of these units. Parts List and Ordering Information The following sections of this chapter provide a parts list and location diagram for the XR900 chassis and its subassemblies.
Support Information Table 5-1. XR900 Chassis Parts List Find Motorola Part Description/Quantity Number Number 01-W2518D01A Blank bezel assembly 01-W2649D01A Front bezel 01-W2651D01A Fan assembly, 119mm 01-W2654D01A Expansion chassis 01-W2722D01A 100W power supply (AC) 01-W2722D02A 100W power supply (DC) 01-W3948B01A SCSI backplane 03SW990F606 Sem, Phillips pan head, 6-32 x 3/8”...
Parts List and Ordering Information 11271.00 9503 Figure 5-1. XR900 Series Chassis...
Index When using this index, keep in mind that a page number indicates only where referenced material begins. It may extend to the page or pages following the page referenced. airflow bezel and FCC compliance 2-1, 2-14 blockages flanges, mounting applying power grounding 1-7, 2-12...
Index pedestal installation power cables 2-11 temperature power distribution system, resetting monitoring operating 2-14, 3-1 power supply limits 2-13 sensors 3-1, 3-4 power supply module thresholds termination, SCSI terminator power rack mounting 2-1, 2-2 test switch radio-frequency interference (RFI) 1-7, rating label, voltage voltage monitoring removal/replacement...