Bus Topology; Sd Bus; Spi Bus; Hot Insertion And Power Protection - SanDisk 2GB - 2GB Micro Secure Digital Card Product Manual

SanDisk microSD™, microSDHC™ and microSDXC™ cards
Each card has a set of information registers. Register descriptions and SDA references
are provided in Section 5.0 of the SDA Physical Layer Specification, Version 3.01.
Table 5: microSD Card Product Family Register Overview
Register
Abbreviation
RCA
CSD
SCR
OCR
SSR
CSR

3.2 Bus Topology

The family of SanDisk microSD products supports two communication protocols: SD
and SPI. For more details, refer to Section 3.5 of the SDA Physical Layer
Specification, Version 3.01. Section 6 of the specification contains a bus circuitry
diagram for reference.
3.2.1

SD Bus

For more details, refer to Section 3.5.1 of the SDA Physical Layer Specification,
Version 3.01.
3.2.2

SPI Bus

For more details, refer to Section 3.5.2 of the SDA Physical Layer Specification,
Version 3.01.

3.3 Hot Insertion and Power Protection

Refer to Section 6.1 and Section 6.2 of the SDA Physical Layer Specification,
Version 3.01.

3.4 Electrical Interface

The power scheme of SanDisk microSD products is handled locally in each card and
in the bus master. Refer to Section 6.4 of the SDA Physical Layer Specification,
Version 3.01.
3.4.1

Power Up

Power must be applied to the VDD pin before any I/O pin is set to logic HIGH. In
other words, CMD, CLK, and DAT0-3 must be at zero (0) volts when power is
applied to the VDD pin. For more information, refer to Section 6.4.1 of the SDA
Physical Layer Specification, Version 3.01.
January 2012 Version 2.5 © 2008 - 2012 SanDisk Corporation. SanDisk Confidential, subject to all applicable non-disclosure agreements 11
Width (in bits)
CID 128
16
128
64
32
512
32
Register Name
Card identification number
Relative card address
Card specific data
SD configuration register
Operation condition register
SD status register
Card status register
OEM Product Manual
2.5