Lead-Free 2Li/Pb-Free 2Li Board - Intel BOXD945GCLF Product Manual

Intel Desktop Board DG945GCLF Product Guide

Lead-free 2LI/Pb-free 2LI Board

The electronics industry is transitioning to European Union (EU) Restriction of
Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the
use of six materials. One of these restricted materials is lead. Lead is the most
common and problematic of the RoHS restricted materials.
There are exemptions in RoHS that allow the use of lead in some very limited locations
in electronic products. Maximum lead concentration values have been established for
RoHS-compliant electronic products that allow up to 1000 ppm of lead.
Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant
products. In this case, the term "Lead-free/Pb-free" means that lead has been
removed where required by the RoHS legislation but still may exist as an impurity
below 1000 ppm.
The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).
The balls, leads, or pads used to connect the component to a printed circuit board are
lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect
exemption.
Desktop Board DG945GCLF is a lead-free second level interconnect product. Table 12
shows the lead-free second level interconnect marks as they appear on the board and
accompanying collateral. These marks are based on JEDEC standard J-STD-609,
"Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free
and Other Attributes."
For more information concerning Intel's lead-free initiatives, refer to
http://www.intel.com/technology/silicon/leadfree.htm.
Table 12. Lead-Free Second Level Interconnect Marks
Description
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Desktop Board
substrate and the solder
connections from the board to
the components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
50
Mark
or
or