Reliability; Thermal Considerations For Components - Intel BOXD915PLWDL - Desktop Board D915PLWDL Manual

Desktop board technical product specification
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Table 31 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 31.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
Intel 82915PL MCH
Intel 82801FB ICH6
For information about
Intel Pentium 4 processor datasheets and specification updates

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D915PLWD board
is 126,666 hours.
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
99
C (under bias)
o
110
C (under bias)
Technical Reference
Refer to
Section 1.2, page 15
59

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