Thermal Considerations For Components - Intel BLKDP55KG - LG1156 MAX-16 GB DDR3 ATX Motherboard Technical Product Specification

Desktop board
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Figure 17. Localized High Temperature Zones
Table 23 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 23. Thermal Considerations for Components
Component
Processor
Intel P55 Express Chipset
For information about
Processor datasheets and specification updates
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel P55 Express Chipset
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111
C (under bias)
Technical Reference
Refer to
Section 1.3, page 14
59

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