Thermal Considerations For Components - Intel DH61BF Technical Product Specification

Intel Desktop Board DH61BF Technical Product Specification
Figure 14 shows the locations of the localized high temperature zones.
Table 24 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 24. Thermal Considerations for Components
Component
Processor
Intel H61 Express Chipset
For information about
Processor datasheets and specification updates
52
Item Description
A Processor voltage regulator area
B Processor
C Intel H61 Express Chipset
Figure 14. Localized High Temperature Zones
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
111 C (under bias)
Refer to
Section 1.2, page 16