Intel BLKDP55SB Technical Product Specification
Intel BLKDP55SB Technical Product Specification

Intel BLKDP55SB Technical Product Specification

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Intel® Desktop Board
DP55SB
Technical Product Specification
September 2009
Order Number: E70714-001US
®
The Intel
Desktop Board DP55SB may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DP55SB Specification Update.

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Summary of Contents for Intel BLKDP55SB

  • Page 1 Order Number: E70714-001US ® The Intel Desktop Board DP55SB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DP55SB Specification Update.
  • Page 2: Revision History

    North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Core i7, and Core i5 are trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others.
  • Page 3: Intended Audience

    ® Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DP55SB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 4 Intel Desktop Board DP55SB Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
  • Page 5: Table Of Contents

    1.3 Online Support................14 1.4 Processor ..................14 1.5 System Memory ................15 1.5.1 Memory Configurations ............16 ® 1.6 Intel P55 Express Chipset ............... 18 1.6.1 USB ................... 18 1.6.2 SATA Interfaces ..............19 1.7 Discrete SATA Controller ..............20 1.7.1...
  • Page 6 Intel Desktop Board DP55SB Technical Product Specification 2 Technical Reference 2.1 Memory Resources ................39 2.1.1 Addressable Memory............. 39 2.1.2 Memory Map................ 41 2.2 Connectors and Headers..............41 2.2.1 Back Panel Connectors ............42 2.2.2 Component-side Connectors and Headers ........ 43 2.3 Jumper Block ..................
  • Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............79 5.1.1 Safety Standards..............79 5.1.2 European Union Declaration of Conformity Statement ....80 5.1.3 Product Ecology Statements........... 81 5.1.4 EMC Regulations ..............85 5.1.5 Product Certification Markings (Board Level)......86 5.2 Battery Disposal Information.............
  • Page 8 Intel Desktop Board DP55SB Technical Product Specification 17. Main Power Connector..............48 18. Front Panel Header ................49 19. States for a One-Color Power LED ............50 20. States for a Two-Color Power LED............50 21. BIOS Setup Configuration Jumper Settings.......... 53 22.
  • Page 9: Product Description

    ― One port used to connect the onboard Bluetooth* Module • Eight internal Serial ATA (SATA) 3.0 Gb/s interfaces: ― Six interfaces through Intel P55 PCH with RAID support (black) ― Two interfaces through a discrete Marvell* controller 88E6145 (blue) •...
  • Page 10 Intel Desktop Board DP55SB Technical Product Specification Table 1. Feature Summary (continued) ® Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82578DC Gigabit LAN Support Ethernet Controller • One PCI Express 2.0 x16 (x8 when the PCI Express x8 connector is used) bus...
  • Page 11: Board Layout

    Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DP55SB. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
  • Page 12: Components Shown In Figure 1

    Intel Desktop Board DP55SB Technical Product Specification Table 2. Components Shown in Figure 1 Item/callout from Figure 1 Description Auxiliary PCI Express graphics power connector (SATA-style) PCI Express 2.0 x8 connector Front panel audio header S/PDIF header PCI Express 2.0 x1 connector Rear chassis fan header PCI Express 2.0 x1 connector...
  • Page 13: Block Diagram

    Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram...
  • Page 14: Legacy Considerations

    Integration information http://www.intel.com/support/go/buildit Processor The board is designed to support the Intel Core i7 and Intel Core i5 processors in an LGA1156 socket Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W with margin to allow for greater than 130 W.
  • Page 15: System Memory

    Product Description System Memory The board has four DIMM sockets and supports the following memory features: • 1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification) • Two independent memory channels with interleaved mode support • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.
  • Page 16: Memory Configurations

    XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm 1.5.1 Memory Configurations The Intel Core i7 and Intel Core i5 processors supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.
  • Page 17: Memory Channel And Dimm Configuration

    Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE For the system to boot, always install memory into the blue DIMM memory slots if only installing two DIMMs in your configuration.
  • Page 18: Intel ® P55 Express Chipset

    Intel P55 Express Chipset The Intel P55 Express Chipset consisting of the Intel P55 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCIe interfaces. The PCH is a centralized controller for the board’s I/O paths.
  • Page 19: Sata Interfaces

    Product Description 1.6.2 SATA Interfaces The board provides eight internal SATA connectors. Six connectors (black) are through the PCH, which support one device per connector, and two additional connectors (blue) from a discrete controller. The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port.
  • Page 20: Discrete Sata Controller

    Intel Desktop Board DP55SB Technical Product Specification Discrete SATA Controller The board includes a discrete Marvell 88E6145 SATA controller that provides two internal SATA ports (blue) and one eSATA port (red) on the back panel. 1.7.1 eSATA Support The red eSATA connector on the back panel can be used to connect an eSATA drive. It can also be used for port replication, which allows the aggregation of multiple hard drives on the eSATA port.
  • Page 21: Legacy I/O Controller

    The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware. Customers are required to buy or create their own interface modules to plug into Intel Desktop Boards for this feature to work.
  • Page 22: 1.10 Audio Subsystem

    Intel Desktop Board DP55SB Technical Product Specification 1.10 Audio Subsystem The board supports the Intel High Definition Audio subsystem based on the Realtek ALC889 audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port.
  • Page 23: 8-Channel (7.1) Audio Subsystem

    Product Description 1.10.3 8-Channel (7.1) Audio Subsystem The 8-channel (7.1) audio subsystem includes the following: • Intel P55 PCH • Realtek ALC889 audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone The back panel audio connectors are configurable through the audio device drivers.
  • Page 24: 1.11 Lan Subsystem

    LAN software and drivers http://downloadcenter.intel.com ® 1.11.1 Intel 82578DC Gigabit Ethernet Controller The Intel 82578DC Gigabit Ethernet Controller supports the following features: • 10/100/1000 BASE-T IEEE 802.3 compliant • PCI Express link • Compliant to IEEE 802.3x flow control support •...
  • Page 25: Lan Subsystem Software

    Product Description 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
  • Page 26: 1.12 Bluetooth* Technology Support

    Intel Desktop Board DP55SB Technical Product Specification 1.12 Bluetooth* Technology Support The Bluetooth Module plus external antenna enables the user to connect with a variety of Bluetooth enabled devices. Driver support is provided by Microsoft operating systems like Microsoft Vista and Microsoft 7. The Bluetooth driver stack is supplied by...
  • Page 27: Fan Monitoring

    Product Description 1.13.2 Fan Monitoring ® Fan monitoring can be implemented using Intel Desktop Control Center or third-party software. For information about Refer to The functions of the fan headers Section 1.14.2.2, page 33 1.13.3 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed.
  • Page 28: Thermal Monitoring

    Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Rear chassis fan header Voltage regulator thermal diode Processor fan header Thermal diode, located on processor die Front chassis fan header Thermal diode, located on the Intel P55 Express Chipset Figure 6. Thermal Sensors and Fan Headers...
  • Page 29: 1.14 Power Management

    Product Description 1.14 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯...
  • Page 30: Power States And Targeted System Power

    Intel Desktop Board DP55SB Technical Product Specification 1.14.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.
  • Page 31: Wake-Up Devices And Events

    Product Description 1.14.1.2 Wake-up Devices and Events Table 7 lists the devices or specific events that can wake the computer from specific states. Table 7. Wake-up Devices and Events These devices/events can wake up the computer… …from this state Note 1) Power switch S1, S3, S4, S5 (Note 1)
  • Page 32: Hardware Support

    Intel Desktop Board DP55SB Technical Product Specification 1.14.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
  • Page 33: Fan Headers

    Product Description 1.14.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 or S1 state • The fans are off when the board is off or in the S3, S4, or S5 state •...
  • Page 34: Instantly Available Pc Technology

    Intel Desktop Board DP55SB Technical Product Specification 1.14.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.
  • Page 35 Product Description 1.14.2.10 +5 V Standby Power Indicator LED and Additional LEDs The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED on the board.
  • Page 36: Locations Of Indicator Leds

    Intel Desktop Board DP55SB Technical Product Specification Figure 7 shows the location of these additional LEDs. Item Description Processor LED (red) Voltage regulator LED (red) Standby power indicator LED (green) SATA drive activity LED (blue) Figure 7. Locations of Indicator LEDs...
  • Page 37: 1.15 Onboard Power Button

    Product Description 1.15 Onboard Power Button The board provides a power button that can be used to turn the computer on or off. This button is intended for use at integration facilities to provide the ability to power on/off the board without the need to attach a front panel switch (the onboard power button duplicates the functionality of the front panel button and functions in exactly the same manner).
  • Page 38: Energy Star* 4.0 And 5.0, E-Standby, And Erp Compliance

    ENERGY STAR* 4.0 and 5.0, E-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. For information about...
  • Page 39: Technical Reference

    Technical Reference Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
  • Page 40: Detailed System Memory Address Map

    Intel Desktop Board DP55SB Technical Product Specification Figure 9. Detailed System Memory Address Map...
  • Page 41: Memory Map

    Technical Reference 2.1.2 Memory Map Table 8 lists the system memory map. Table 8. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS...
  • Page 42: Back Panel Connectors

    Intel Desktop Board DP55SB Technical Product Specification 2.2.1 Back Panel Connectors Figure 10 shows the location of the back panel connectors for the board. Item Description eSATA port Back-to-BIOS button S/PDIF in (optical) S/PDIF out (optical) USB ports IEEE 1394a connector...
  • Page 43: Component-Side Connectors And Headers

    Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11. Component-side Connectors and Headers Table 9 lists the component-side connectors and headers identified in Figure 11.
  • Page 44: Component-Side Connectors And Headers Shown In Figure 11

    Intel Desktop Board DP55SB Technical Product Specification Table 9. Component-side Connectors and Headers Shown in Figure 11 Item/callout from Figure 11 Description PCI Express 2.0 x8 connector Front panel audio header S/PDIF header PCI Express 2.0 x1 connector Rear chassis fan header PCI Express x1 connector PCI Express 2.0 x16 connector...
  • Page 45: Ieee 1394A Header

    Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 10. IEEE 1394a Header Signal Name Signal Name Data A (positive) Data A (negative) Ground Ground Data B (positive) Data B (negative) +12 V DC +12 V DC Key (no pin) Ground Table 11.
  • Page 46: Chassis Intrusion Header

    Intel Desktop Board DP55SB Technical Product Specification Table 14. Chassis Intrusion Header Signal Name Intruder# Ground Table 15. Processor, Front and Rear Chassis (4-Pin) Fan Headers Signal Name (Note) Ground +12 V FAN_TACH FAN_CONTROL Note: These fan headers use Pulse Width Modulation control for fan speed.
  • Page 47: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When...
  • Page 48: Main Power Connector

    Intel Desktop Board DP55SB Technical Product Specification Table 17. Main Power Connector Signal Name Signal Name +3.3 V +3.3 V +3.3 V -12 V Ground Ground +5 V PS-ON# (power supply remote on/off) Ground Ground +5 V Ground Ground Ground...
  • Page 49: Connection Diagram For Front Panel Header

    Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 18 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table 18. Front Panel Header Signal Description Signal...
  • Page 50: States For A One-Color Power Led

    Intel Desktop Board DP55SB Technical Product Specification 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.
  • Page 51: Connection Diagram For Front Panel Usb Headers

    Technical Reference 2.2.2.5 Front Panel USB Headers Figure 13 is a connection diagram for the front panel USB headers. NOTE • The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
  • Page 52: Jumper Block

    Intel Desktop Board DP55SB Technical Product Specification Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.
  • Page 53: Bios Setup Configuration Jumper Settings

    Technical Reference Table 21. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal The BIOS uses current configuration information and passwords for booting. Configure After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings.
  • Page 54: Mechanical Considerations

    Intel Desktop Board DP55SB Technical Product Specification Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters].
  • Page 55: Electrical Considerations

    Table 22. Recommended Power Supply Current Values Output Voltage 3.3 V 12 V1 12 V2 -12 V 5 VSB Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A For information about Refer to Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb /CS-026472.htm...
  • Page 56: Fan Header Current Capability

    Intel Desktop Board DP55SB Technical Product Specification 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.
  • Page 57: Thermal Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm...
  • Page 58: Localized High Temperature Zones

    Intel Desktop Board DP55SB Technical Product Specification Item Description Processor voltage regulator area Processor Intel P55 Express Chipset Figure 17. Localized High Temperature Zones Table 24 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures.
  • Page 59: Reliability

    Technical Reference Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC.
  • Page 60 Intel Desktop Board DP55SB Technical Product Specification...
  • Page 61: Overview Of Bios Features

    Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.
  • Page 62: Bios Flash Memory Organization

    Intel Desktop Board DP55SB Technical Product Specification Table 26 lists the BIOS Setup program menu features. Table 26. BIOS Setup Program Menu Bar Maintenance Main Advanced Performance Security Power Boot Exit Clears Displays Configures Configures Sets Configures Selects Saves or...
  • Page 63: System Management Bios (Smbios)

    6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit.
  • Page 64: Bios Updates

    Intel Desktop Board DP55SB Technical Product Specification To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: ®...
  • Page 65: Custom Splash Screen

    The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about ®...
  • Page 66: Boot Options

    Intel Desktop Board DP55SB Technical Product Specification Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, optical drive, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the optical drive third.
  • Page 67: Adjusting Boot Speed

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.
  • Page 68: 3.10 Bios Security Features

    Intel Desktop Board DP55SB Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...
  • Page 69: 3.11 Bios Performance Features

    Overview of BIOS Features 3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Core i5 processors in an LGA 1156 socket. • Processor frequency adjustment •...
  • Page 70 Intel Desktop Board DP55SB Technical Product Specification...
  • Page 71: Error Messages And Beep Codes

    Error Messages and Beep Codes Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 31).
  • Page 72: Front-Panel Power Led Blink Codes

    Intel Desktop Board DP55SB Technical Product Specification Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 32). Table 32. Front-panel Power LED Blink Codes...
  • Page 73: Port 80H Post Codes

    Error Messages and Beep Codes Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
  • Page 74: Port 80H Post Codes

    Intel Desktop Board DP55SB Technical Product Specification Table 35. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization...
  • Page 75 Error Messages and Beep Codes Table 35. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only) Mouse (USB) Resetting mouse Disabling mouse...
  • Page 76 Intel Desktop Board DP55SB Technical Product Specification Table 35. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state...
  • Page 77 Error Messages and Beep Codes Table 36. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus...
  • Page 78 Intel Desktop Board DP55SB Technical Product Specification...
  • Page 79: Regulatory Compliance And Battery Disposal Information

    Electromagnetic Compatibility (EMC) standards • Product certification markings 5.1.1 Safety Standards Intel Desktop Board DP55SB complies with the safety standards stated in Table 37 when correctly installed in a compatible host system. Table 37. Safety Standards Standard Title CSA/UL 60950-1, First Edition Information Technology Equipment –...
  • Page 80: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DP55SB is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
  • Page 81: Product Ecology Statements

    恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 82 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 83: Lead Free Desktop Board

    RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Intel Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability.
  • Page 84: Lead-Free Board Markings

    Intel Desktop Board DP55SB Technical Product Specification Table 38. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board...
  • Page 85: Emc Regulations

    Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DP55SB complies with the EMC regulations stated in Table 39 when correctly installed in a compatible host system. Table 39. EMC Regulations Regulation Title FCC 47 CFR Part 15,...
  • Page 86: Product Certification Markings (Board Level)

    EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DP55SB has the product certification markings shown in Table 40: Table 40. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark.
  • Page 87: Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect.
  • Page 88 Intel Desktop Board DP55SB Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 89 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 90 Intel Desktop Board DP55SB Technical Product Specification...

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