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Intel® Desktop Board
DG965PZ
Technical Product Specification
®
The Intel
Desktop Board DG965PZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965PZ Specification Update.
August 2006
Order Number: D56009-001US
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Table of Contents
Related Manuals for Intel BLKDG965PZMKR - Conroe LGA775 1066 800FSB DDR2 A/V Lan Raid SATA pBTX Motherboard
Summary of Contents for Intel BLKDG965PZMKR - Conroe LGA775 1066 800FSB DDR2 A/V Lan Raid SATA pBTX Motherboard
- Page 1 Order Number: D56009-001US ® The Intel Desktop Board DG965PZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG965PZ Specification Update.
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Page 2: Revision History
Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. -
Page 3: Intended Audience
Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG965PZ. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG965PZ and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. - Page 4 Intel Desktop Board DG965PZ Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
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Page 5: Table Of Contents
1.4 System Memory ................16 1.4.1 Memory Configurations ............18 1.5 Intel ® G965 Express Chipset ............. 23 1.5.1 Intel G965 Graphics Subsystem..........23 1.5.2 USB ................... 26 1.5.3 Serial ATA Interfaces ............27 1.5.4 Real-Time Clock, CMOS SRAM, and Battery ......27 1.6 Audio Subsystem................ - Page 6 Intel Desktop Board DG965PZ Technical Product Specification 2.8 Jumper Block .................. 58 2.9 Mechanical Considerations ..............59 2.9.1 Form Factor................. 59 2.9.2 I/O Shield ................60 2.10 Electrical Considerations ..............61 2.10.1 DC Loading................61 2.10.2 Fan Header Current Capability..........61 2.10.3 Add-in Board Considerations ..........
- Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............81 5.1.1 Safety Regulations..............81 5.1.2 European Union Declaration of Conformity Statement ....82 5.1.3 Product Ecology Statements........... 84 5.1.4 EMC Regulations ..............87 5.1.5 Product Certification Markings (Board Level)......88 5.2 Battery Disposal Information.............
- Page 8 Intel Desktop Board DG965PZ Technical Product Specification 11. Wake-up Devices and Events ............36 12. System Memory Map ............... 43 13. DMA Channels................. 43 14. I/O Map ..................44 15. PCI Configuration Space Map ............45 16. Interrupts ..................46 17.
- Page 9 Product Description What This Chapter Contains Overview....................10 Online Support ...................15 Processor ....................15 System Memory ..................16 ® Intel G965 Express Chipset................23 Audio Subsystem..................28 LAN Subsystem ..................30 Hardware Management Subsystem ...............32 Power Management ..................34...
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Page 10: Overview
• Two IEEE-1394a interfaces: one back panel connector and one front-panel header • Four Serial ATA interfaces ® LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DC Gigabit Ethernet Controller ® • Intel BIOS (resident in the SPI Flash device) BIOS •... -
Page 11: Manufacturing Options
1.1.2 Manufacturing Options Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options One of the following: Audio subsystem •... -
Page 12: Board Layout
Intel Desktop Board DG965PZ Technical Product Specification 1.1.3 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 3 lists the components identified in Figure 1. -
Page 13: Board Components Shown In Figure 1
IEEE-1394a front panel header Front panel USB headers [2] PCI Express x16 connector Main Power connector Front chassis fan header Intel 82801HR/HH I/O Controller Hub (ICH8) BIOS Setup configuration jumper block Chassis intrusion header Front panel header Auxiliary front panel power LED header... -
Page 14: Block Diagram
Intel Desktop Board DG965PZ Technical Product Specification 1.1.4 Block Diagram Figure 2 is a block diagram of the major functional areas. Gigabit Ethernet PCI Express Controller Connector Mini Card Connector System Bus LGA775 (1066/800/533 Processor MHz) Socket Back Panel/Front Panel... -
Page 15: Online Support
Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus •... -
Page 16: System Memory
Intel Desktop Board DG965PZ Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. -
Page 17: Memory Operating Frequencies
Product Description NOTE Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz. -
Page 18: Memory Configurations
Intel Desktop Board DG965PZ Technical Product Specification 1.4.1 Memory Configurations The Intel 82G965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. -
Page 19: Dual Channel (Interleaved) Mode Configuration With Two Dimms
Product Description 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. Channel A, DIMM 0 1 GB Channel A, DIMM 1 Channel B, DIMM 0 1 GB Channel B, DIMM 1... -
Page 20: Dual Channel (Interleaved) Mode Configuration With Four Dimms
Intel Desktop Board DG965PZ Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. -
Page 21: Single Channel (Asymmetric) Mode Configuration With One Dimm
Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 512 MB Channel A, DIMM 1... -
Page 22: Flex Mode Configuration With Two Dimms
Intel Desktop Board DG965PZ Technical Product Specification 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: •... -
Page 23: Intel ® G965 Express Chipset
G965 Express Chipset ® The Intel G965 Express chipset consists of the following devices: • Intel 82G965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • One of the following: ⎯ Intel 82801HR I/O Controller Hub (ICH8R) with DMI interconnect ⎯... - Page 24 Intel Desktop Board DG965PZ Technical Product Specification • 3D Graphics Rendering enhancements ⎯ 1.3 dual texture GigaPixel/sec fill rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯...
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Page 25: Dvi Port Status Conditions
NOTE The use of DVMT requires operating system driver support. 1.5.1.3 Configuration Modes A list of supported modes for the Intel GMA X3000 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.2, page 15... -
Page 26: Usb
400 MHz pixel clock. When an ADD2/MEC card is detected, the Intel GMA X3000 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card. -
Page 27: Serial Ata Interfaces
Product Description 1.5.3 Serial ATA Interfaces The board provides four Serial ATA (SATA) connectors, which support one device per connector. 1.5.3.1 Serial ATA Support The ICH8’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of four Serial ATA devices. -
Page 28: Audio Subsystem
Back panel – Pink Back panel – Black Back panel - Orange 1.6.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15... -
Page 29: Audio Connectors And Headers
Product Description 1.6.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. -
Page 30: Lan Subsystem
• PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities ⎯ LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® 1.7.1 Intel 82566DC Gigabit Ethernet Controller The Intel 82566DC Gigabit Ethernet Controller supports the following features: •... -
Page 31: Lan Subsystem Software
Product Description 1.7.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.7.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below). -
Page 32: Hardware Management Subsystem
Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.8.2 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.9.2.2, page 37... -
Page 33: Thermal Monitoring
Product Description 1.8.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. Item Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8 die Remote thermal sensor Processor fan Front chassis fan Rear chassis fan... -
Page 34: Power Management
⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Intel Quick Resume Technology Drivers (Intel QRTD) (optional) 1.9.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. -
Page 35: Power States And Targeted System Power
Product Description 1.9.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. -
Page 36: Hardware Support
Intel Desktop Board DG965PZ Technical Product Specification 1.9.1.2 Two-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power. -
Page 37: Power Connector
• WAKE# signal wake-up support • Intel Quick Resume Technology Drivers (QRTD) (optional) LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. -
Page 38: Lan Wake Capabilities
Intel Desktop Board DG965PZ Technical Product Specification 1.9.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. -
Page 39: Resume On Ring
Target resume time is zero to five seconds (about equal to the time it takes for the display to warm up). CAUTION Do not open the computer chassis when it is in the Intel QRTD off state. Opening the chassis in this state can cause hardware damage. 1.9.2.6... -
Page 40: Location Of The Standby Power Indicator Led
Intel Desktop Board DG965PZ Technical Product Specification 1.9.2.9 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 13 shows the location of the standby power indicator LED. -
Page 41: Technical Reference
Technical Reference What This Chapter Contains Memory Map ....................41 DMA Channels....................43 Fixed I/O Map ....................44 PCI Configuration Space Map ...............45 Interrupts....................46 PCI Interrupt Routing Map ................47 Connectors and Headers................48 Jumper Block .....................58 Mechanical Considerations ................59 2.10 Electrical Considerations ................61 2.11 Thermal Considerations ................63 2.12 Reliability ....................65 2.13 Environmental....................66 Memory Map... -
Page 42: Detailed System Memory Address Map
Intel Desktop Board DG965PZ Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. -
Page 43: Dma Channels
Technical Reference Table 12 lists the system memory map. Table 12. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K... -
Page 44: Fixed I/O Map
Intel Desktop Board DG965PZ Technical Product Specification Fixed I/O Map Table 14. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board DG965PZ. Refer to the ICH8 data sheet for dynamic addressing information. (Note 1) -
Page 45: Pci Configuration Space Map
Table 15. PCI Configuration Space Map Device Function Number (hex) Number (hex) Number (hex) Description Memory controller of Intel 82G965 component (Note 1) PCI Express x16 graphics port Integrated graphics controller Intel High Definition Audio Controller Mini PCI Express connector... -
Page 46: Interrupts
Intel Desktop Board DG965PZ Technical Product Specification Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. -
Page 47: Pci Interrupt Routing Map
Technical Reference PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. -
Page 48: Connectors And Headers
Intel Desktop Board DG965PZ Technical Product Specification Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. -
Page 49: Back Panel Connectors
Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. OM18393 Item Description VGA port DVI-D connector (digital output only) USB ports [2] USB ports [2] IEEE-1394a USB ports [2] Center channel and LFE (subwoofer) audio out/Retasking Jack Surround left/right channel audio out/Retasking Jack Audio line in Digital audio out optical... -
Page 50: Component-Side Connectors And Headers
Intel Desktop Board DG965PZ Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. Figure 16. Component-side Connectors and Headers... -
Page 51: Component-Side Connectors And Headers Shown In Figure 16
Technical Reference Table 18 lists the component-side connectors and headers identified in Figure 16. Table 18. Component-side Connectors and Headers Shown in Figure 16 Item/callout from Figure 16 Description IEEE-1394a front panel header Front panel USB header Front panel USB header PCI Express x16 add-in card connector Front chassis fan header Main power connector... -
Page 52: Serial Ata Connectors
Intel Desktop Board DG965PZ Technical Product Specification Table 22. Serial ATA Connectors Signal Name Ground Ground Ground Table 23. High Definition Audio Link Header Signal Name Signal Name BCLK Ground 3.3 V/1.5 V I/O SYNC Ground 3.3V_CORE +12 V No connect... -
Page 53: Add-In Card Connectors
Technical Reference 2.7.2.1 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth. •... -
Page 54: Processor Core Power Connector
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When... -
Page 55: Connection Diagram For Front Panel Header
Technical Reference 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 28 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header. Table 28. Front Panel Header Signal Description Signal... -
Page 56: States For A One-Color Power Led
Intel Desktop Board DG965PZ Technical Product Specification 2.7.2.3.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. -
Page 57: Connection Diagram For Front Panel Usb Headers
Technical Reference 2.7.2.5 Front Panel USB Headers Figure 18 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. -
Page 58: Jumper Block
Intel Desktop Board DG965PZ Technical Product Specification Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. -
Page 59: Mechanical Considerations
Technical Reference Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 8.0 inches by 10.50 inches [203.20 millimeters by 266.70 millimeters]. -
Page 60: I/O Shield
Intel Desktop Board DG965PZ Technical Product Specification 2.9.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 22 shows the I/O shield. Dimensions are given in millimeters [inches]. -
Page 61: 2.10 Electrical Considerations
Technical Reference 2.10 Electrical Considerations 2.10.1 DC Loading Table 33 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. -
Page 62: Add-In Board Considerations
Intel Desktop Board DG965PZ Technical Product Specification 2.10.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (the PCI Express Mini Card connector and the PCI Express x16 connector filled) must not exceed 4 A. -
Page 63: 2.11 Thermal Considerations
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm... -
Page 64: Localized High Temperature Zones
Intel Desktop Board DG965PZ Technical Product Specification Figure 23 shows the locations of the localized high temperature zones. Item Description Intel 82801HR/HH ICH8 1.5 V core and front side bus voltage regulator areas Processor Processor voltage regulator area Intel 82G965 GMCH... -
Page 65: 2.12 Reliability
Table 35. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82G965 GMCH C (under bias) Intel 82801HR/HH ICH8R/ICH8DH C (under bias) For information about Refer to Processor datasheets and specification updates Section 1.2, page 15... -
Page 66: 2.13 Environmental
Intel Desktop Board DG965PZ Technical Product Specification 2.13 Environmental Table 36 lists the environmental specifications for the board. Table 36. Desktop Board DG965PZ Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C... -
Page 67: Overview Of Bios Features
3.10 BIOS Security Features ................74 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. -
Page 68: Bios Flash Memory Organization
Intel Desktop Board DG965PZ Technical Product Specification Table 37 lists the BIOS Setup program menu features. Table 37. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Configures Selects Saves or Clears Displays Configures Sets passwords and... -
Page 69: System Management Bios (Smbios)
Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. -
Page 70: Bios Updates
The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 15... -
Page 71: Bios Recovery
For information about Refer to BIOS recovery http://support.intel.com/support/motherboards/desktop Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, CD-ROM, or the network. The default setting is for the hard drive to be the first boot device. -
Page 72: Booting Without Attached Devices
Intel Desktop Board DG965PZ Technical Product Specification 3.8.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: •... -
Page 73: Adjusting Boot Speed
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. -
Page 74: 3.10 Bios Security Features
Intel Desktop Board DG965PZ Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •... -
Page 75: Error Messages And Beep Codes
Error Messages and Beep Codes What This Chapter Contains Speaker ....................75 BIOS Beep Codes ..................75 BIOS Error Messages ..................75 Port 80h POST Codes ..................76 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 12... -
Page 76: 4.4 Port 80H Post Codes
Intel Desktop Board DG965PZ Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. -
Page 77: Port 80H Post Codes
Error Messages and Beep Codes Table 45. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory... - Page 78 Intel Desktop Board DG965PZ Technical Product Specification Table 45. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
- Page 79 Error Messages and Beep Codes Table 45. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
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Page 80: Typical Port 80H Post Sequence
Intel Desktop Board DG965PZ Technical Product Specification Table 46. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase... -
Page 81: Regulatory Compliance And Battery Disposal Information
Regulatory Compliance and Battery Disposal Information What This Chapter Contains Regulatory Compliance................81 Battery Disposal Information ................89 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG965PZ: • Safety regulations • European Union Declaration of Conformity statement •... -
Page 82: European Union Declaration Of Conformity Statement
European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG965PZ is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive). - Page 83 Regulatory Compliance and Battery Disposal Information Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG.
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Page 84: Product Ecology Statements
请参考 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der... - Page 85 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
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Page 86: Lead-Free Board Markings
Intel Desktop Board DG965PZ Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını... -
Page 87: Emc Regulations
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DG965PZ complies with the EMC regulations stated in Table 49 when correctly installed in a compatible host system. Table 49. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices. -
Page 88: Product Certification Markings (Board Level)
Intel Desktop Board DG965PZ Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DG965PZ has the product certification markings shown in Table 50: Table 50. -
Page 89: Battery Disposal Information
Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. - Page 90 Intel Desktop Board DG965PZ Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
- Page 91 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
- Page 92 Intel Desktop Board DG965PZ Technical Product Specification...