Installing Dimms - HP dx7510 - Microtower PC Service & Reference Manual

and the remainder is assigned to single channel. For optimal speed, the channels should be
balanced so that the largest amount of memory is spread between the two channels. If one channel
will have more memory than the other, the larger amount should be assigned to Channel A. For
example, if you are populating the sockets with one 1GB DIMM, and three 512MB DIMMs, Channel
A should be populated with the 1GB DIMM and one 512MB DIMM, and Channel B should be
populated with the two 512MB DIMMs. With this configuration, 2GB will run as dual channel and
512MB will run as single channel.
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In any mode, the maximum operational speed is determined by the slowest DIMM in the system.

Installing DIMMs

CAUTION:
drain before adding or removing memory modules. Regardless of the power-on state, voltage is always
supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding
or removing memory modules while voltage is present may cause irreparable damage to the memory
modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly
2. Remove the access panel
3. Locate the memory module sockets on the system board.
WARNING!
components to cool before touching.
38 Chapter 6 Removal and Replacement Procedures Microtower (MT) Chassis
You must disconnect the power cord and wait approximately 30 seconds for the power to
(Access Panel on page
To reduce risk of personal injury from hot surfaces, allow the internal system
(Preparation for Disassembly on page
33).
32).