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MEIG SRM825N Hardware Design Manual

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MeiG SRM825N Module Hardware Design Manual
MeiG SRM825N Module
Hardware Design Manual
Controlled Version Number: V1.3
Release Date: 2022/08
MeiG Smart Technology Co., Ltd.
1/58

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Summary of Contents for MEIG SRM825N

  • Page 1 MeiG SRM825N Module Hardware Design Manual MeiG SRM825N Module Hardware Design Manual Controlled Version Number: V1.3 Release Date: 2022/08 MeiG Smart Technology Co., Ltd. 1/58...

  • Page 2: Important Notice

    Copyright Notice All rights reserved. MeiG Smart Technology Co., Ltd This manual and all its contents are owned by MeiG Smart Technology Co., Ltd and protected by Chinese laws and relevant copyright laws in applicable international conventions. Without the written authorization of MeiG Smart Technology Co., Ltd, no one may copy, disseminate, distribute, modify or use part or all of this manual in any form, and the offenders will be held responsible according to law.

  • Page 3: Revision History

    MeiG SRM825N Module Hardware Design Manual Revision History Version Number Date Reason for Revision V1.0 2022-03-10 First Edition Modify chapter 2.3 block diagram and content Modify chapter 3.6 size information in the eSIM description V1.1 2022-03-15 Modify chapter 3.11.2 picture information Modify chapter 3.11 antenna part information...

  • Page 4: Table Of Contents

    MeiG SRM825N Module Hardware Design Manual Contents Important Notice ............................1 Revision History ............................2 Contents ..............................3 Table Index ..............................5 Figure Index .............................. 6 Introduction ............................7 Safety Instructions ........................8 Purpose of the Document ......................9 List of Contents ......................... 9 Product Overview ...........................
  • Page 5 ESD Characteristic ......................... 48 Thermal design ........................48 Mechanical Characteristics ......................51 Basic description ........................51 Mechanical Dimensions of the SRM825N Module ..............51 M.2 connector ......................... 52 Packaging ..........................52 Annex A Reference Documents and Abbreviations ..............55 Reference Documents ......................55 Abbreviations ..........................
  • Page 6 MeiG SRM825N Module Hardware Design Manual Table Index Table 1 Frequency Bands Supported by SRM825N Module ..............10 Table 2 Main Features of the Module ......................10 Table 3 IO Parameter Definition ........................15 Table 4 M.2 Pin Description ........................15 Table 5 Power related interface ........................
  • Page 7 Figure 17 PCM Circuit Reference Design ..................... 31 Figure 18 PCIe Circuit Reference Design ..................... 32 Figure 19 SRM825N Antenna Location Map ....................34 Figure 20 SMT Connection Size (unit: mm) ....................35 Figure 21 IPEX4 generation cable series ..................... 35 Figure 22 Schematic diagram of inserting coaxial cable plug...............

  • Page 8: Introduction

    MeiG SRM825N Module Hardware Design Manual Introduction This document defines SRM825N module air interface and hardware interface for connecting the module to applications of customers. This document can help customers quickly understand the interface specifications, electrical characteristics, mechanical specifications and related product information of SRM825N module. With the help of this document, according to our application manual and user guide, customers can quickly apply SRM825N module to wireless applications.

  • Page 9: Safety Instructions

    MeiG SRM825N Module Hardware Design Manual Safety Instructions By complying with the following safety principles, you can ensure personal safety and protect the products and working environment from potential damage: Driving safety first! When you drive, do not use handheld mobile terminal device unless it has a hands-free function.

  • Page 10: Purpose Of The Document

    MeiG SRM825N Module Hardware Design Manual Purpose of the Document This document mainly describes the hardware interface and structural characteristics of the SRM825N wireless module, and guides users to embed the SRM825N module in the design of various application terminals. List of Contents This document is divided into the following parts: ...

  • Page 11: Product Overview

    3G/4G/5G network standards, which can cover the 5G commercial network frequency bands of major regions and operators around the world. At the same time, the SRM825N module supports Qualcomm I Z a t ™ Gen 9 positioning technology, a built-in multi-constellation high-precision GNSS receiver, can support GPS/GLONASS/BeiDou/Galileo/ QZSS, and can provide fast and accurate positioning services.
  • Page 12 MeiG SRM825N Module Hardware Design Manual  VIN supply voltage range: 3.135V ~ 4.4V Power supply  Typical supply voltage: 3.8V  Class 2 (26dBm+2/-3dB) for 5G NR; SRM825N-EA: N41/N77/N78/N79;  Class 2 (26dBm+2/-3dB) for 4G; Transmitting power SRM825N-EA: B41 ...
  • Page 13 GNSS features  Protocol: NMEA 0183  RX-diversity Support 5G NR/LTE/WCDMA diversity  Compliant with 3GPP TS 27.007, 27.005, newly add MeiG AT AT command command  Network indication WWAN_LED# pin indicates the status of the RF network  ANT0, ANT1, ANT2, ANT3 Antenna interface ...

  • Page 14: Functional Block Diagram

    Figure 1 Functional Block Diagram Evaluation Board To help test and use SRM825N module, MeiG Smart Technology Co., Ltd provides a set of evaluation board. Evaluation board tools include USB data cable, antenna and other peripherals. MeiG Smart Technology Co., Ltd.

  • Page 15: Application Interface

    MeiG SRM825N Module Hardware Design Manual Application Interface Basic Description The physical interface and signal level of the SRM825N module comply with PCIe M.2 specifications. This chapter mainly introduces the function definition and interface application of the module interface: ...
  • Page 16 MeiG SRM825N Module Hardware Design Manual Table 3 IO Parameter Definition Type Description Input and output two-way signal Digital input Digital output Power input Power output Analog input Analog output Open-drain output Table 4 M.2 Pin Description SRM825N Pin Name...
  • Page 17 MeiG SRM825N Module Hardware Design Manual WWAN_LED# Network status indicator Notch Notch Notch Notch Notch Notch Notch Notch 1.8V power domain, PCM_CLK PCM clock signal unconnected when not in use. 1.8V power domain; SPI1_CS/M2_R1_PON SPI chip select signal The second function M2_R1_PON 1.8V power domain,...
  • Page 18 MeiG SRM825N Module Hardware Design Manual USIM1_RESET (U) SIM1card reset signal USB3.0 differential sends USB3.0_TX_P positive signal USIM1_CLK (U) SIM1 card clock signal External pull-up to USIM1_DATA (U) SIM1 card data signal UISM1_VDD is required USB3.0 differential USB3.0_RX_M receiving negative signal (U) SIM1card power 1.8V/3.0V power...
  • Page 19 MeiG SRM825N Module Hardware Design Manual positive signal 3.3V power domain, PCIE reset signal, active PCIE_RST_N unconnected when not low voltage in use. 3.3V power domain, PCIE clock request signal, PCIE_CLKREQ_N unconnected when not active low voltage in use. PCIE differential clock...

  • Page 20: Power Supply

    MeiG SRM825N Module Hardware Design Manual to 1.8V Module reset signal, active RESET_N low voltage 1.8V power domain; SDX2AP_STATUS/VR Module to AP status The second function EG_RF_1.9V control signal supplies power to the external RF chip. 1.8V power domain; SPI1_MISO/M3_R1_P...

  • Page 21: Reduce Voltage Drop

    3.3.2 Reduce Voltage Drop The power supply range of SRM825N is 3.135V~4.4V, typical value is 3.8V. In order to ensure the normal operation of the module, the power supply must have sufficient power supply capability and the input voltage must not be lower than 3.135V. If the instantaneous voltage drop causes the VIN supply voltage is too low, the module will be restarted or shut down.

  • Page 22: Starting / Shutdown

    MeiG SRM825N Module Hardware Design Manual voltage and the output voltage, it is recommended to use DCDC as the power supply for the module. When the external power supply is connected to the module, VIN needs to use star routing.

  • Page 23: Reset_N Control Signal

    Figure 7 FULL_CARD_PWR_OFF# Shutdown Sequence Diagram Table 6 FULL_CARD_PWR_OFF#Signal DC Features FULL_CARD_PWR_OFF# Min. Typ. Max. Unit 1.8/3.3 -0.3 RESET_N Control Signal There are two reset methods for SRM825N: hardware reset and AT command reset. MeiG Smart Technology Co., Ltd. 22/58...

  • Page 24: Reset By Hardware

    MeiG SRM825N Module Hardware Design Manual 3.5.1 Reset by Hardware When the module is working, pull down the RESET_N pin for 500mS to reset the module. RESET_N signal is very sensitive to interference, so it is recommended that the routing on the module interface board should be as short as possible and coated with ground wire.

  • Page 25: Reset By At Command

    Resetting Figure 10 RESET_N Reset Sequence Diagram 3.5.2 Reset by AT Command Through the AT port of the SRM825N USB, input the AT+RESET command to reset and restart the SRM825N. USIM/SIM Interface USIM card interface circuit meets the requirements of ETSI and IMT-2000 SIM interfaces. SRM825N supports USIM card of 1.8V and 3.0V.
  • Page 26 MeiG SRM825N Module Hardware Design Manual up to 1.8V SRM825N module supports the hot plug function of USIM card through the USIM1_DET pin, which supports high-level detection, and the hot plug function is turned off by default. In the figure 11, after the SIM card is inserted, the USIM1_DET pin is at low level.

  • Page 27: Usb Interface

    USB Interface SRM825N provides the USB interface that is compliant with USB3.1 Gen2 regulation, the theoretical max throughput can reach to 10Gb/s, the USB interface is used to the interaction of AT command, data transmission, software debug, version update, etc.

  • Page 28: Usb Reference Circuit

    Need 90Ω differential USB High-speed receiption USB_SS_RX_M siganl - impedance 3.7.2 USB Reference Circuit The application reference circuit of SRM825N module USB interface is shown in the figure below. Test Points Module ESD Array USB_DM USB_HS_DM USB_HS_DP USB_DP USB_TX_P...

  • Page 29: Usb Driver

    3.7.3 USB Driver SRM825N module supports each OS, Windows 7/8/10, embedded OS: Linux2.6 or higher version, Android2.3/4.0/4.2/4.4/5.0/5.1/6.0/7.0/8.0/9.0/10.0, need special USB driver. USB driver provides different files for different OS, VID and PID, please contact technical support for details .

  • Page 30: Flight Mode

    I/O or AT command. 3.8.1.1 Hardware IO to control flight mode Module is give a low-level signal by W_DISABLE_N (PIN8) of SRM825N, module enters into fligt mode, then RF (Transimission/Receiption) stops working, GNSS is prohibited. Pull up PIN8, module will enter into normal mode, GNSS is recovered to work.

  • Page 31: Wwan_Led# Control Signal

    MeiG SRM825N Module Hardware Design Manual Table 11 WAKE_ON_WAN# PIN Description WAKE_ON_WAN# Status Running Status Transmit 1-sec low-pulse signal Receive phone call, SMS, data (to wake up terminal) Keep high-level Unoccupied/Sleep Figure 14 Control Wave of PIN WAKE_ON_WAN# VCC from the Host...

  • Page 32: Dpr Control Signal

    MeiG SRM825N Module Hardware Design Manual 3.8.5 DPR Control Signal One of SRM852 interfaces DPR(Pin25) is used to SAR detection, the signal is from the sensor of terminal to trigger module to decrease the power of transmission/receiption. Table 13 DPR PIN Description...

  • Page 33: Pcie Interface

    MeiG SRM825N Module Hardware Design Manual 3.10 PCIe Interface The SRM825N module provides a group of PCIe Gen3 interfaces. The maximum rate of each lane of PCIe Gen3 is 8Gb/s. Table 15 PCIe PIN Description PIN Name PIN No. Description...

  • Page 34: Antenna Interface

    3.11 Antenna Interface 3.11.1 Antenna Definition SRM825N module provides 5 antenna pins, which are: GNSS, ANT0, ANT1, ANT2, ANT3, as shown in the table below. Table 16 Antenna Pin Assignment...
  • Page 35 MeiG SRM825N Module Hardware Design Manual NR: N1 N3 N40 N7 N38; WCDMA: B1; LTE: B5 B8 B18 B19 B20 B28; NR: N5 N8 N20 N28; WCDMA: B5 B8; UHB: LTE: B42; NR: N41 N77 N78 N79; 2. Antenna scheme The module does not support LB+LB/MHB+MHB interband CA/ENDC.

  • Page 36: Recommended Rf Connector

    MeiG SRM825N Module Hardware Design Manual Loss when inserting cable: < 2dB (LTE B7/B38/B40/B41) (5G_sub6 N41/N78) 3.11.2 Recommended RF Connector The following figure shows the size of the RF connector: Figure 20 SMT Connection Size (unit: mm) Use IPEX4 generation of cables, as shown below: Figure 21 IPEX4 generation cable series MeiG Smart Technology Co., Ltd.

  • Page 37: Recommend The Rf Connector Assembly

    MeiG SRM825N Module Hardware Design Manual 3.11.3 Recommend the RF Connector Assembly Manual insertion of coaxial cable plug schematic diagram is shown below, θ must be 90°. Figure 22 Schematic diagram of inserting coaxial cable plug Manually pull coaxial cable plug diagram is shown below, θ must be 90°.

  • Page 38: Fixture Inserts And Unplugs Coaxial Cable Plug

    For more details, please visit http://www.ectsz.com. 3.12 GNSS Performance SRM825N includes a completely embedded GNSS solution, supports Gen9C-Lite (GPS, GLONASS, Galile & BeiDou). Only the L1 band is supported. Active antennas are recommended because the module space is limited and does not contain LNA.
  • Page 39 MeiG SRM825N Module Hardware Design Manual Hot reboot <5S Cold reboot <60S Sensitivity Capture -145dBm Track -158dBm MeiG Smart Technology Co., Ltd. 38/58...

  • Page 40: Electrical Characteristics

    0.25 Temperature Range SRM825N is recommended to work in-30~75℃ environment. It is suggested that end user should consider temperature control under a severe environment. The limited operating temperature range of the module is also provided. Under such temperature condition, some RF indexes may exceed the standard.

  • Page 41: Electrical Characteristics Of Interface Operating State

    3.135 USIM_VDD 1.7/2.75 1.8/2.85 1.9/2.95 Power Range The following is the power consumption of SRM825N module in each working mode (module 3.8V power supply), for more frequency band information, please contact us. Table 23 Power Consumption Type Mode Band Typical...
  • Page 42 MeiG SRM825N Module Hardware Design Manual for a long time, USB2.0)) WCDMA B1 @-50dbm WCDMA B1_10562 HSDPA@23.9dBm WCDMA B1_10700 HSDPA@23.8dBm WCDMA B1_10838 HSDPA@23.7dBm WCDMA B5 @-50dbm WCDMA B5_4357 HSDPA@24.3dBm WCDMA WCDMA B5_4408 HSDPA@24.4dBm WCDMA B5_4458 HSDPA@24.3dBm WCDMA B8 @-50dbm WCDMA B8_2937 HSUPA@24.3dBm...
  • Page 43 MeiG SRM825N Module Hardware Design Manual FDD- LTE B5(high channel)10M@23.5dBm FDD- LTE B7@-45dbm FDD- LTE B7(low channel)20M@22.8dBm FDD- LTE B7(middle channel)20M@22.8dBm FDD- LTE B7(high channel)20M@22.8dBm FDD- LTE B8@-45dbm FDD- LTE B8(low channel)10M@23.5dBm FDD- LTE B8(middle channel)10M@23.4dBm FDD- LTE B8(high channel)10M@23.4dBm...
  • Page 44 MeiG SRM825N Module Hardware Design Manual channel)20M@23.2dBm FDD- LTE B28(high channel)20M@23.2dBm TDD- LTE B34@-45dbm TDD- LTE B34(low channel)10M@23dBm TDD- LTE B34(middle channel)10M@23dBm TDD- LTE B34(high channel)10M@23dBm TDD- LTE B38@-45dbm TDD- LTE B38(low channel)20M@23dBm TDD- LTE B38(middle channel)20M@23dBm TDD- LTE B38(high channel)20M@23.1dBm...
  • Page 45 MeiG SRM825N Module Hardware Design Manual TDD- LTE B42 (middle channel)20M@24.2dBm TDD- LTE B42 (high channel)20M@23.2dBm N1 40M CH388000 0dBm N1 40M CH390000 0dBm N1 40M CH392000 0dBm N3 30M CH345000 0dBm N3 30M CH349500 0dBm N3 30M CH354000 0dBm...
  • Page 46 MeiG SRM825N Module Hardware Design Manual N41 100M CH518598 0dBm N41 100M CH528000 0dBm N77 100M CH623334 0dBm N77 100M CH650000 0dBm N77 100M CH676666 0dBm N78 100M CH623334 0dBm N78 100M CH636666 0dBm N78 100M CH650000 0dBm N79 100M CH697094 0dBm...

  • Page 47: Environmental Reliability Requirements

    MeiG SRM825N Module Hardware Design Manual N28 30M CH146600 23.2dBm N38 40M CH518000 23dBm N38 40M CH519000 23.1dBm N38 40M CH520000 23.3dBm N40 80M CH468000 25.3dBm N40 80M CH470000 25dBm N40 80M CH472000 25.3dBm N41 100M CH509202 23.8dBm ULMIMO CP N41 100M CH518598 23.6dBm...
  • Page 48 MeiG SRM825N Module Hardware Design Manual Temperature +90℃, shut down mode for 48 hours, Tc (sample recovery High temp storage time) : 2h Low temp running Temperature -40℃, working for 48 hours, Tc (sample recovery time) : 2h High temp running Temperature +85℃, working for 48 hours, Tc (sample recovery time) : 2h...

  • Page 49: Esd Characteristic

    ②The air discharge pass ± 1 KV test grade ESD Characteristic SRM825N is an industrial product. Even ESD issues have been considered and set ESD protected in module design. However, ESD problems may also occur in transport and secondary development, so a developer should consider the final product ESD protection.
  • Page 50 MeiG SRM825N Module Hardware Design Manual connector selection.) MeiG Smart Technology Co., Ltd. 49/58...
  • Page 51 MeiG SRM825N Module Hardware Design Manual The following is a reference design diagram. It is recommended to use both, which is more conducive to product performance. Figure 25 Thermal design example(Heat sink is on the front side of module) MeiG Smart Technology Co., Ltd.

  • Page 52: Mechanical Characteristics

    MeiG SRM825N Module Hardware Design Manual Mechanical Characteristics Basic description This chapter mainly introduces the mechanical dimensions and packaging specifications of SRM825N. Mechanical Dimensions of the SRM825N Module Figure 26 SRM825N Mechanical Dimensions (unit：mm) MeiG Smart Technology Co., Ltd. 51/58...

  • Page 53: Connector

    MeiG SRM825N Module Hardware Design Manual M.2 connector The user board using the SRM825N module can refer to the M.2 connector socket of Lotes, model: AP-APCI0105. As shown below: Figure 27 AP-APCI0105 connector Note: AP-APCI0105 and AP-APCI0078-P package P2P. The difference is that AP-APCI0105 H4.2 is more conducive to attaching a thermal pad under the M.2 module to facilitate heat treatment, while the...
  • Page 54 MeiG SRM825N Module Hardware Design Manual 1. Wear gloves before working, keep the work surface clean, tidy and free of dust; 2. Take 7 pallets (6+1) of the board after the QA inspection is OK and send it to a packing box;...
  • Page 55 MeiG SRM825N Module Hardware Design Manual MeiG Smart Technology Co., Ltd. 54/58...

  • Page 56: Annex A Reference Documents And Abbreviations

    MeiG SRM825N Module Hardware Design Manual Annex A Reference Documents and Abbreviations Reference Documents  SRM825N AT command set; Abbreviations Table 26 Abbreviations Abbreviations Description Adaptive Multi-rate Bit Error Rate Base Transceiver Station Peripheral Component Interconnect Circuit Switched (CS) domain...
  • Page 57 MeiG SRM825N Module Hardware Design Manual Half Rate HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HSPA HSPA High-Speed Packet Access HSPA+ HSPA High-Speed Packet Access+ International Electro-technical Commission IMEI International Mobile Equipment Identity MEID Mobile Equipment Identifier...
  • Page 58 MeiG SRM825N Module Hardware Design Manual TCP/IP Transmission Control Protocol/ Internet Protocol UART Universal asynchronous receiver-transmitter USIM Universal Subscriber Identity Module UMTS Universal Mobile Telecommunications System Universal Serial Bus WCDMA Wideband Code Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access...

  • Page 59: Annex B Gprs Coding Scheme

    MeiG SRM825N Module Hardware Design Manual Annex B GPRS Coding Scheme Table 27 Description of Different Coding Schemes Mode CS-1 CS-2 CS-3 CS-4 Code rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data rate Kb/s 9.05...

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