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MEIG SNM909 Hardware Design Manual

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MeiG_SNM909_Hardware Design Manual
Hardware Design
SNM909
Manual
Release date:2022.11
Controlled file name: SNM909 Hardware Design Manual
Controlled version number: V1.00
Publishing organization：MeiG Smart Technology Co., Ltd
MeiG Smart Technology Co., Ltd
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  • Page 1 MeiG_SNM909_Hardware Design Manual Hardware Design SNM909 Manual Release date:2022.11 Controlled file name: SNM909 Hardware Design Manual Controlled version number: V1.00 Publishing organization：MeiG Smart Technology Co., Ltd MeiG Smart Technology Co., Ltd Page 1...

  • Page 2: Important Notice

    Copyright Notice All rights reserved. MeiG Smart Technology Co., Ltd This manual and all its contents are owned by MeiG Smart Technology Co., Ltd and protected by Chinese laws and relevant copyright laws in applicable international conventions. Without the written authorization of MeiG Smart Technology Co., Ltd, no one may copy, disseminate, distribute, modify...

  • Page 3: Safety Warning

    Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules. The user should be informed of the following safety information on the terminal device. Otherwise, Meig will not be responsible for any consequences caused by the user not following these warning actions.
  • Page 4 MeiG_SNM909_Hardware Design Manual SNM909 Hardware Design Manual_V1.00 MeiG Smart Technology Co., Ltd Page 4...
  • Page 5 MeiG_SNM909_Hardware Design Manual Foreword Thank you for using the SNM909 module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user.

  • Page 6: Table Of Contents

    5.7 VCOIN Feature Current consumption（VBAT=3.8V） ................60 5.8 Current consumption（VBAT=3.8V） ......................61 5.9 Electrostatic Protection ..........................61 5.10 WIFI Main RF Performance ........................61 5.11 BT Main RF Performance ..........................62 5.12 Important Notice to OEM integrator-----------------------------------------------------------------------------65 MeiG Smart Technology Co., Ltd Page 6...
  • Page 7 6.1 Top and Bottom Views of The Module ......................67 6.2 Humidity Sensitivity (MSL) .......................... 66 6.3 Baking Requirements ............................. 67 7 Appendix ..................................68 7.1 Related Documents ............................68 7.2 Terms and Explanations ..........................70 MeiG Smart Technology Co., Ltd Page 7...

  • Page 8: Revision History

    MeiG_SNM909_Hardware Design Manual Revision History Date Revision Description Author 2022/11/05 1.00 First version Hardware MeiG Smart Technology Co., Ltd Page 8...

  • Page 9: Introduction

    RF interface. It can help users quickly understand the interface definition, electrical performance, and structural dimensions of the module. Combining this document with other application documents, users can quickly use modules to design mobile communication applications. MeiG Smart Technology Co., Ltd Page 9...

  • Page 10: Module Overview

    MeiG_SNM909_Hardware Design Manual 2 Module overview SNM909 core board, the main chip is Qualcomm Snapdragon 600 series SDM660, the CPU is made of 14nm FinFET, built-in 64bit ARM, 8-core Kryo 260 CPU (Kryo Gold: quad high-performance cores targeting 2.2 GHz, Kryo Silver: quad low-power cores targeting 1.843 GHz).

  • Page 11: Summary Of Features

    MeiG_SNM909_Hardware Design Manual 2.1 Summary of features Table 2.1: SNM909 features Product Description characteristics Platform Qualcomm SDM660 Octa-core Kryo 260 CPU Adreno512;650MHz System memory 32GB eMMC + 3GB LPDDR4X 1866Mhz可兼容64GB+4GB,128GB+8GB Android 10.0 Size 40*35*2.89mm Wi-Fi WCN3990:IEEE 802.11b/g/n/a/ac 2.4G&5G Bluetooth BT 5.x Matrix: FULL HD: 2560*1600 60fps;...

  • Page 12: Block Diagram

     LCD/CAM-MIPI interface  EMCP --Memory chip  AUDIO interface  Serial ports, SD card interface, SIM interface, I2C interface, etc.  Figure 2.1: Functional block diagram of the module 3 Module Package MeiG Smart Technology Co., Ltd Page 12...

  • Page 13: Pin Definitions

    Input power from the selected source (USB or WiPower), or output during USB-OTG. This is a B21,B22 USB_VBUS_IN PI, PO power entry node for the charger and connects to the OVP circuitry. C5-C7 MeiG Smart Technology Co., Ltd Page 13...
  • Page 14 SPKR_DRV_M CDC_IN1_P Microphone input 1, plus WLED low-side current sink input, WLED_SINK1 string 1 RGB LED high-side current source RGB_GRN for the green LED VREG_L6B_3P3_1 L6B LDO regulated output VREG_BOB Regulated BOB output MeiG Smart Technology Co., Ltd Page 14...
  • Page 15 MIPI display serial interface 1 clock BB16 MIPI_DSI1_CLK_N – negative BB17 USB0_SS_TX_P USB super-speed 0 transmit – plus BB18 USB1_SS_RX_M USB super-speed 1 receive – minus BB19 USB1_SS_TX_M USB super-speed 1 transmit – minus MeiG Smart Technology Co., Ltd Page 15...
  • Page 16 UART between WiPower IC WP_IF and BT subsystem to exchange WiPower related messages. L8-L9 Module internal used. Do not PON_OUT connect (leave floating). BEEP_VOL2 GPIO_11 Configurable I/O QNOVO_FET_CTL GPIO_13 Qnovo FET discharge control MeiG Smart Technology Co., Ltd Page 16...
  • Page 17 MIPI CSI 1, differential clock – plus MIPI CSI 1, differential clock – MIPI_CSI1_CLK_M minus BLSP_GPIO_31 GPIO_31 BLSP 8 bit 0; SPI, UART, or I2C BLSP_GPIO_30 GPIO_30 BLSP 8 bit 1; SPI, UART, or I2C MeiG Smart Technology Co., Ltd Page 17...
  • Page 18 Configurable I/O P23-P24 SDM660_GPIO_35 GPIO_35 B-PD:nppukp Configurable I/O Q2-Q4 VREG_L13A_1P8 L13A LDO regulated output Q5-Q9 Q18-Q19 LPI_SPI_1_CS0_N LPI_GPIO_8 LPI SPI 1 chip select Q21-Q24 Boot configuration control bit 0; BOOT_CONFIG_0 GPIO_96 B-PD:nppukp Configurable I/O MeiG Smart Technology Co., Ltd Page 18...
  • Page 19 Type-C powered cables. Haptics H-bridge driver output PMI_HAP_OUT_M minus VREG_L15A_UIM1 L15A LDO regulated output Input power from the selected source E21-E22 USB_VBUS_IN PI, PO (USB or WiPower),or output during MeiG Smart Technology Co., Ltd Page 19...
  • Page 20 OVP circuitry. VREG_L11A_1P8 L11A LDO regulated output UIM1_RESET GPIO_89 UIM1 reset VREG_L14A_1P8 L14A LDO regulated output G1-G8 CDC_MIC_BIAS1 Microphone bias 1 PM660L_GPIO REAR_DVDD_EN Enable for camera LDO2 MeiG Smart Technology Co., Ltd Page 20...
  • Page 21 Active-high input indicating when A QI_PMA_ON Qi/PMA wireless input is connected. H22-H23 Battery temperature input to ADC BATT_THERM for measuring the pack temperature. VREG_L12A_1P8 L12A LDO regulated output MeiG Smart Technology Co., Ltd Page 21...
  • Page 22 Configurable I/O Power-supply hold signal from the PS_HOLD SDM660 device’s PS_HOLD output to PMIC PM660. SCAN_POWER_2 GPIO_80 B-PD: nppukp Configurable I/O K2-K5 Module internal used. Do not LPI_UART_1_RX connect (leave floating) K7-K8 K10-K18 MeiG Smart Technology Co., Ltd Page 22...
  • Page 23 C_SDA SMB_PWR_BLSP2_I2 GPIO_7 PM3003A I2C serial clock C_SCL MIPI_CSI0_LANE0_P MIPI CSI 0, differential lane 0 – plus MIPI CSI 0, differential lane 0 – MIPI_CSI0_LANE0_M minus U15-U16 NFC_ESE_PWR_REQ GPIO_20 B-PD: nppukp Configurable I/O MeiG Smart Technology Co., Ltd Page 23...
  • Page 24 MIPI CSI 2, differential clock – plus B-PD:nppukp configuration control bit 10; BOOT_CONFIG_10 GPIO_92 Boot Configurable I/O B-PD:nppukp configuration control bit 11; BOOT_CONFIG_11 GPIO_93 Boot Configurable I/O I2C_CLK_BATT GPIO_11 Battery I2C serial clock ACCL_GYRO_DRDY_ GPIO_68 B-PD: nppukp Configurable I/O MeiG Smart Technology Co., Ltd Page 24...
  • Page 25 LPI SPI 2 chip select LPI_GPIO_17 LPI_GPIO_17 B-PD: nppukp LPI bit 17 LPI_GPIO_27 LPI_GPIO_27 LPI DMIC 1 data MIPI_CSI0_LANE2_P MIPI CSI 0, differential lane 2 – plus MIPI CSI 0, differential lane 2 – MIPI_CSI0_LANE2_M minus MeiG Smart Technology Co., Ltd Page 25...
  • Page 26 MIPI display serial interface 0 lane MIPI_DSI0_LANE2_N AI, AO 2– negative KYPD_INT GPIO_9 B-PD: nppukp Configurable I/O Y19-Y20 DisplayPort auxiliary channel – EDP_AUX_P AI, AO positive Y22-Y24 Boot configuration control bit 8; BOOT_CONFIG_8 GPIO_95 B-PD:nppukp Configurable I/O MeiG Smart Technology Co., Ltd Page 26...

  • Page 27: Mechanical Dimensions

    NP：pdpukp=defaultno-pull with programmable options following the colon (:) PD：nppukp=defaultpulldown with programmable options following the colon (:) PU：nppdkp=defaultpullup with programmable options following the colon (:) KP：nppdpu=defaultkeeper with programmable options following the colon (:) 3.2 Mechanical Dimensions MeiG Smart Technology Co., Ltd Page 27...
  • Page 28 Figure 3.1: Module 3D size (unit: mm) MeiG Smart Technology Co., Ltd Page 28...
  • Page 29 Figure 3.2: Recommended PCB package size (unit: mm) MeiG Smart Technology Co., Ltd Page 29...

  • Page 30: Interface Application

    Figure 4.1: VBAT input reference circuit If it is a DC power supply device, the DC input voltage is 4.5V-17V. The recommended circuit that can be powered by DC-DC is shown below: MeiG Smart Technology Co., Ltd Page 30...

  • Page 31: Power Pin

    3.5V even when the module consumes 4A. If the voltage drops below 3.5V, the module may shut down. The PCB layout from the VBAT pin to the power supply should be wide enough to reduce the voltage drop in the transmit burst mode. MeiG Smart Technology Co., Ltd Page 31...

  • Page 32: Power Pcb Layout

    (Z9) is pulled low. CBL_PWR_N can be powered on by 10K pull-down resistor to GND. It does not need to release this signal after booting. Figure 4.5: Using an external signal to drive the module to boot MeiG Smart Technology Co., Ltd Page 32...

  • Page 33: Module Shutdown

    电路的设计。模块检测到关机动作以后，屏幕会有提示窗弹出，确认是否执行关机动作。 4.2.3 Module Reset The SNM909 module supports a reset function that allows the user to quickly restart the module by pulling the RESET_N pin (M23) of the module low. The recommended circuit is as follows: MeiG Smart Technology Co., Ltd...
  • Page 34 GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET can refer to the following table: Table4.1: RESET Hardware Parameters Maximu Description Minimum Typical Unit Input high level Input low level 0.65 RESET Pull down 11.2 effective time MeiG Smart Technology Co., Ltd Page 34...

  • Page 35: Vcoin 电源

    4.4 Power Output The SNM909 has multiple power outputs. For SD card, SIM card, sensor, touch panel, external LDO power supply, etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference.

  • Page 36: Serial Port

    4.5 Serial Port The SNM909 provides three serial ports for communication. There should be three groups of I2C interfaces that can be multiplexed into hardware flow control. Note that no pull resistance can be added when the I2C interface is multiplexed into UART_RTS/CTS.
  • Page 37 Only the matching circuits on TX and RX are listed here. Other low speed signals can refer to these two circuits. Figure 4.13: TX Connection Diagram MeiG Smart Technology Co., Ltd Page 37...

  • Page 38: Mipi Interface

    4.6.1 LCD Interface The SNM909 module supports the MIPI interface of two sets of LCD displays, supports dual-screen display, and MeiG Smart Technology Co., Ltd Page 38...
  • Page 39 LCD series backlight positive VREG_WLED electrode VREG_L11A_1P8 1.8V power Sub display interface MIPI_DSI1_CLK_N BB16 MIPI_LCD clock MIPI_DSI1_CLK_P CC16 MIPI_DSI1_LANE0_N BB13 MIPI_DSI1_LANE0_P CC13 MIPI_DSI1_LANE1_N BB14 MIPI_DSI1_LANE1_P CC14 MIPI_LCD data MIPI_DSI1_LANE2_N BB15 MIPI_DSI1_LANE2_P MIPI_DSI1_LANE3_N BB12 MeiG Smart Technology Co., Ltd Page 39...
  • Page 40 LDO_2P8 must be generated by an external 2.8V LDO, and the LDO circuit can be seen in FIG. 4.16. In the design of the main and secondary screens, it is recommended to use two 2.8V Ldos to supply power to the main and secondary screens respectively. MeiG Smart Technology Co., Ltd Page 40...
  • Page 41 The software adjusts the backlight brightness by configuring the current of WLED_SINK.  In the main and secondary screen design, the main screen can directly use the SNM909 internal backlight circuit VREG_WLED, WLED_SINK1, WLED_SINK2, up to 2 strings of 8 lights each, a total of 16 lights; The backlight driver circuit of the secondary screen can be referred to Figure 4.18.

  • Page 42: Mipi Camera Interface

    4.6.2 MIPI Camera Interface SNM909 module supports MIPI Camera interface, the main camera is CSI0 interface, supports four groups of data lines, can support a maximum of 24M pixels. The front camera is a CSI2 interface, supports four groups of data lines, and can support 16M pixels.
  • Page 43 Please pay attention to the length of the trace. It is not recommended to add a small capacitor on the MIPI signal line. This may affect the rising edge of the MIPI data. This in turn causes the MIPI data to be invalid. MeiG Smart Technology Co., Ltd Page 43...
  • Page 44 Figure 4.18: MIPI Camera reference circuit The power supply required by the Camera, including AVDD-2.8V, AFVDD-2.8V(focusing motor power supply) and DVDD-1.2V(CAM nuclear voltage), can be designed with reference to the following LDO circuit MeiG Smart Technology Co., Ltd Page 44...

  • Page 45: Mipi Pcb Layout

    GPIO15_TS_KP_I2C_SCL VREG_L11A_1P8 Interrupt GPIO67_TS_INT_N Reset GPIO66_TS_RESET_N 1.8V power VREG_L11A_1P8 Note:The interface definition of the capacitive touch can be adjusted by software, and the user can change the GPIO MeiG Smart Technology Co., Ltd Page 45...

  • Page 46: Audio Interface

    Users are advised to use the following circuit according to the actual application to get better sound effects. 4.8.1 Receiver Interface Circuit The receiver interface circuit places the following devices near the REC end, and the B302 and B303 can be changed to magnetic beads according to the actual effect. MeiG Smart Technology Co., Ltd Page 46...

  • Page 47: Microphone Receiving Circuit

    The module integrates a stereo headphone jack. Users are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as an interrupt. In software, this pin is the earphone MeiG Smart Technology Co., Ltd Page 47...

  • Page 48: Speaker Interface Circuit

    TI-TS3A226AE. 4.8.4 Speaker interface circuit The module is integrated with a Class-D audio power amplifier, the output power is 0.8W, and the output signal is SPKR_DRV_P/SPKR_DRV_M. MeiG Smart Technology Co., Ltd Page 48...

  • Page 49: Usb Interface

    SNM909 supports one USB 2.0 interface, one USB 3.0 interface, and must control 90 ohm differential impedance in Layout, and control the external cable length. It should be noted that the SNM909 module must be controlled by hardware to switch the TYPE-C, MIRCO USB interface. The required pins for the switching circuit are shown in the following table: Table 4.9: USB interface switch pin definition...
  • Page 50 TVS, the user should pay attention to the load capacitance of less than 1pf. VBUS also needs to increase the TVS tube. If there is anti-surge demand, it is also necessary to increase the anti-surge tube. The connection diagram is as follows: MeiG Smart Technology Co., Ltd Page 50...

  • Page 51: Usb Otg

    Figure 4.26: USB Connection Diagram 4.9.1 USB OTG The SNM909 module can provide USB OTG function. The pins used in this function are as follows: Table4.11: USB- OTG pin description Pin name Description B21、B22、C21、 5V charging input /OTG output power supply.

  • Page 52: Usb Pcb Layout

    If there is a test point, try to avoid the cable bifurcation, and put the test point on the path of the cable. 4.10 Charging Interface The SNM909 module integrates 3A charging scheme. This manual only describes the internal charging scheme. The SDM660 platform uses Qualcomm PM660 internal integrated charging chip by default, which is switching mode and has the characteristics of high efficiency.

  • Page 53: Charging Detection

    4.05V. 4.10.3 BAT_CON_TEM The SNM909 module has a battery temperature detection function, which can be implemented by the user through BATT_THERM (H24). This requires a 10KΩ thermistor (negative temperature coefficient) to be integrated into the battery and connected to the BAT_THERM pin. During the charging process, the software will read the voltage of MeiG Smart Technology Co., Ltd...

  • Page 54: Uim Card Interface

    In order to protect the SIM card, it is recommended to use TVS devices for electrostatic protection. The device of the peripheral circuit of the SIM card should be close to the SIM card holder. The reference circuit is as follows: Figure 4.30: UIM card interface circuit MeiG Smart Technology Co., Ltd Page 54...

  • Page 55: Uim Card Pcb Layout

     Strong current passes through the VBAT backflow path. Therefore, avoid the backflow path of the SIM card as much as possible. 4.12 SD Card Interface The SNM909 supports an SD card interface with a maximum support of 128GB The reference circuit is as follows: Figure 4.31: SD card interface circuit MeiG Smart Technology Co., Ltd...

  • Page 56: I2C Bus Interface

    4.13 I2C Bus Interface The SNM909 module supports hardware I2C bus interface and two camera dedicated CCI interfaces. Pin definitions and default functions are as follows: Table 4.12: I2C interface pin description Name Default function CCI_I2C_SDA0 Camera I2C CCI_I2C_SCL0 LPI_I2C_3_SDA...

  • Page 57: Pwm

    The LCD_BKL_PWM(C14) pin can be used to adjust the backlight of the LCD, and adjust the backlight brightness by adjusting the duty cycle. 4.16 Motor The SNM909 supports the motor function, which can be implemented by PMI_HAP_OUT_M (E19) and PMI_HAP_OUT_P (D18). 4.17 Antenna Interface The module provides two antenna interfaces for WiFi/BT_5G and WiFi/BT_2.4G antennas.

  • Page 58: Antenna Pcb Layout

     If the antenna is connected by a coaxial RF line, care should be taken to avoid the coaxial RF line across the SIM card, power circuit and high-speed digital circuit, so as to minimize the impact between each other. MeiG Smart Technology Co., Ltd Page 58...

  • Page 59: Electrical, Reliability

    ℃ Storage temperature ℃ 5.3 Working Voltage Table 5.3: Module Operating Voltage Parameter Minimum Typical Maximum Unit VBAT 3.55 VBUS Hardware shutdown voltage 5.4 Digital Interface Features Table 5.4: Digital Interface Features (1.8V) MeiG Smart Technology Co., Ltd Page 59...

  • Page 60: Sim_Vdd Feature

    High level PWRKEY Low level Effective time 3000 5.7 VCOIN Feature Current consumption （VBAT=3.8V） Table 5.7: VCOIN Characteristics Parameter Description Minimum Typical Maximum Unit VCOIN input VCOIN 3.25 voltage VCOIN Output VCOIN -OUT voltage MeiG Smart Technology Co., Ltd Page 60...

  • Page 61: Current Consumption（Vbat=3.8V

    Transmit power (maximum rate) EVM (maximum rate) Receiving performance Receiving sensitivity 802.11B 802.11G 802.11N Minimum rate Maximum rate Transmission performance 802.11A 802.11AC Transmit power (minimum rate) Transmit power (maximum rate) EVM (maximum rate) Receiving performance MeiG Smart Technology Co., Ltd Page 61...

  • Page 62: Bt Main Rf Performance

    Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. MeiG Smart Technology Co., Ltd Page 62...

  • Page 63: Important Note

    If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2APJ4-SNM909” The FCC ID can be used only when all FCC compliance requirements are met.

  • Page 64: Manual Information To The End User

    If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. MeiG Smart Technology Co., Ltd Page 64...

  • Page 65: Radiation Exposure Statement

    CE Statement Hereby, [MeiG Smart Technology Co., Ltd] declares that the radio equipment type [SNM909] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: https://www.meigsmart.com/.

  • Page 66: Production

    Figure 6.1: Module top and bottom views 6.2 Humidity Sensitivity (MSL) The SNM909 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient conditions of temperature <30 ℃ and relative humidity <60%.

  • Page 67: Baking Requirements

    96 hours at temperatures above 90°C and as high as 125°C. 6.3 Baking Requirements Due to the humidity sensitivity of the module, the SNM909 should be thoroughly baked prior to reflow soldering, otherwise the module may cause permanent damage during reflow soldering. The SNM909 should be baked for 192 hours in a cryogenic vessel at 40°C +5°C/-0°C and a relative humidity of less than 5%, or in a high temperature...

  • Page 68: Appendix

    Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific GSM 03.38： information Digital cellular telecommunications system (Phase 2)；Mobile Station (MS) GSM 11.10 conformance specification；Part 1：Conformance specification AN_Serial Port AN_Serial Port Figure 7.1: Module recommended soldering furnace temperature curve MeiG Smart Technology Co., Ltd Page 68...

  • Page 69: Terms And Explanations

    Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value) Receive Direction Subscriber Identification Module Short Message Service MeiG Smart Technology Co., Ltd Page 69...
  • Page 70 Mobile Equipment list of unanswered MT calls (missed calls) SIM (or ME) own numbers (MSISDNs) list Mobile Equipment list of received calls SIM phonebook Not connect MeiG Smart Technology Co., Ltd. Add: 2nd Floor,Office Building,No.5 Lingxia Road,Fenghuang,Fuyong Street,Bao'an District,Shenzhen China. Tel: 0755-83213556 http://www.meigsmart.com MeiG Smart Technology Co., Ltd...

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