Servicing Notes - Sony HCD-MD1EX - System Service Manual

Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer's instructions.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY A ! MARK ON THE SCHEMATIC
DIAGRAMS, EXPLODED VIEWS AND IN THE PARTS LIST ARE
CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR
AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the "S curve check" in "CD section adjustment" and
check that the S curve waveforms is output three times.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Note:
Be sure to connect all wires (including FFC) in the MD
section before applying power or ICs may be damaged.
ATTENTION AUX COMPOSANTS RELATIFS ÀLA
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE ! SUR LES
SCHÉMAS DE PRINCIPE, LES VUES EXPLOSÉES ET LES
LISTES DE PIECES
SONT D'UNE IMPORTANCE CRITIQUE POUR LA SÉCURITÉ DU
FONCTIONNEMENT. NE LES REMPLACER QUE PAR DES
COMPOSANTS SONY DONT LE NUMÉRO DE PIÉCE EST
INDIQUÉ DANS LE PRÉSENT MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
– 6 –
SÉCURITÉ!