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FLIR
LEPTON® Engineering Datasheet
General Description
Lepton® is a complete long-wave infrared
(LWIR) camera module designed to interface
easily into native mobile-device interfaces and
other consumer electronics. It captures infrared
radiation input in its nominal response
wavelength band (from 8 to 14 microns) and
outputs a uniform thermal image with
1
radiometry
to provide temperature image with
measurements.
Lepton Features
Integral shutter configurations
Configurations with 25°, 50° and 57°
HFOV (f/1.1 silicon doublet)
LWIR sensor, wavelength 8 to 14 µm
Arrays with 80x60 and 160x120 active
pixels available
Thermal sensitivity <50 mK
Integrated digital thermal image
processing functions, including
automatic thermal environment
compensation, noise filters, non-
uniformity correction, and gain control
Radiometric accuracy
o High gain: ±5C @ 25°C
o Low gain ±10C @ 25°C
Radiometric Leptons
temperature measurement including
per pixel and frame radiometric output
(TLinear) and Spotmeter
Export compliant frame rate (< 9 Hz)
SPI video interface
Two-wire I2C serial control interface
1
Radiometric Leptons are 2.5 and 3.5.
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
1
2
1
(35°C blackbody)
1
feature
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
Uses standard cell-phone-compatible
power supplies: 2.8 V to sensor, 1.2 V to
digital core, and flexible IO from 2.8 V
to 3.1 V
Fast time to image (< 1.2 sec)
Low operating power
o Nominally 160 mW
o 800mW typical during shutter
event (~1s)
o Low power mode 5 mW
RoHS compliant
32- pin socket interface to standard
Molex or similar side-contact connector
Applications
Mobile phones
Gesture recognition
Building automation
Thermal imaging
Night vision
2
All specifications subject to change without notice

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Summarization of Contents

Applications
Mobile phones
Application area for the Lepton camera.
Gesture recognition
Application area for the Lepton camera.
Building automation
Application area for the Lepton camera.
Thermal imaging
Application area for the Lepton camera.
Night vision
Application area for the Lepton camera.
1 Introduction
1.4 Device Overview
High-level introduction to the Lepton camera module.
1.5 Key Specifications
Summary of essential technical specifications for Lepton.
1.6 System Architecture
Overview of the internal architecture and components of Lepton.
2 Functional Description
2.1 FPA Interface Module
Describes the module handling the Focal Plane Array interface.
2.2 System Control (Sys Ctrl) Module
Explains the system control module for timing and clocks.
2.4 Software-based Video Processing (SVP Core) Module
Describes the DSP engine for video processing.
2.11 Video Pipeline
Overview of the image processing stages.
3 Operating States and Modes
3.1 Power States
Describes the different power states of the Lepton module.
3.2 FFC States
Describes the different Flat Field Correction states.
3.3 Gain States
Explains the different gain states for sensitivity adjustment.
3.5 Radiometry Modes
Modes for radiometric data acquisition and output.
4 Interface Descriptions
4.1 Command and Control Interface
How to communicate with and control the Lepton module.
4.1.1 User Defaults Feature
Customizing default settings for easier startup.
4.2 VoSPI Channel
Details the Video Over SPI protocol for data transfer.
6 Mounting Specifications
6.1 Socket Information
Details about compatible sockets for the Lepton module.
6.2 Mechanical Considerations
Important mechanical design considerations for integration.
7 Image Characteristics
NETD
Noise Equivalent Temperature Difference.
Intra-scene Range
The range of temperatures the camera can measure.
9 Electrical Specifications
9.1 Lepton pin-out
Diagram showing the pin configuration of the Lepton module.
9.2 DC and Logic Level Specifications
DC voltage and logic level parameters.
9.3 AC Electrical Characteristics
AC timing and frequency characteristics.
9.4 Absolute Maximum Ratings
Electrical stress limits to prevent damage.
10 Environmental Specifications
Operating Temperature Range
Allowed operating temperature range for the camera.
Mechanical Shock
Resistance to mechanical shock.
ESD
Electrostatic Discharge protection.

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