Manual Revision Information; Thermal Solutions - Intel 630 - Pentium 4 630 3.0GHz 800MHz 2MB Socket 775 CPU User Manual

Manual Revision Information

Reversion Revision History
3.0 Third Edition
Item Checklist
630TCF/630TCN motherboard
Cable for IDE/Floppy
CD for motherboard utilities
¡ ¼ Cable for USB Port 3/4 (Option)
630TCF/630TCN User's Manual

Intel Processor Family

Thermal Solutions

As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping
the processor below its specified maximum case temperature. Heatsinks induce
improved processor heat dissipation through increased surface area and concentrated
airflow from attached fans. In addition, interface materials allow effective transfers
of heat from the processor to the heatsink. For optimum heat transfer, Intel
recommends the use of thermal grease and mounting clips to attach the heatsink to
the processor.
When selecting a thermal solution for your system, please refer to the website below
for collection of heatsinks evaluated and recommended by Intel for use with Intel
processors.
Vendor list for heatsink and fan of Pentium® !!! processor, please visit¡ G
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of Intel®Celeron™ processor, please visit¡ G
http://developer.intel.com/design/celeron/components/index.htm
Date
January 2002
2