Compaq BL10e - HP ProLiant - 512 MB RAM Configuration
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Compaq BL10e - HP ProLiant - 512 MB RAM Configuration

Compaq BL10e - HP ProLiant - 512 MB RAM Configuration

Hp bladesystem c-class architecture
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HP BladeSystem c-Class architecture
technology brief, 2nd edition
Abstract.............................................................................................................................................. 3
Evaluating requirements for next-generation server and storage blades ...................................................... 4
HP BladeSystem c-Class architecture overview......................................................................................... 4
Component overview ........................................................................................................................... 5
General-purpose compute solution ......................................................................................................... 7
Physically scalable form factors.......................................................................................................... 7
NonStop signal midplane provides flexibility ..................................................................................... 10
NonStop signal midplane enables modularity.................................................................................... 14
Server-class components ................................................................................................................. 14
NonStop signal midplane scalability ................................................................................................ 15
Power backplane scalability and reliability........................................................................................ 18
Power and cooling architecture with HP Thermal Logic ........................................................................... 18
Server blades and processors .......................................................................................................... 19
Enclosure ...................................................................................................................................... 19
Configuration and management technologies ....................................................................................... 21
Integrated Lights-out technology ....................................................................................................... 21
Onboard Administrator................................................................................................................... 21
Virtualized network infrastructure with Virtual Connect technology ....................................................... 23
Availability technologies..................................................................................................................... 25
Redundant configurations................................................................................................................ 25
Reliable components....................................................................................................................... 25
Blade form factors ........................................................................................................................ 7
Interconnect form factors ............................................................................................................... 9
Star topology ............................................................................................................................... 9
Physical layer similarities among I/O fabrics ................................................................................. 10
Connectivity between blades and interconnect modules .................................................................. 12
Best practices............................................................................................................................. 15
Separate power backplane ......................................................................................................... 16
Channel topology and emphasis settings....................................................................................... 16
Signal midplane provides reliability.............................................................................................. 17
Meeting data center configurations............................................................................................... 19
High-efficiency voltage conversions .............................................................................................. 19
Dynamic Power Saver Mode........................................................................................................ 20
Active Cool fans......................................................................................................................... 20
PARSEC architecture ................................................................................................................... 20

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Summary of Contents for Compaq BL10e - HP ProLiant - 512 MB RAM

  • Page 1: Table Of Contents

    HP BladeSystem c-Class architecture technology brief, 2nd edition Abstract.............................. 3 Evaluating requirements for next-generation server and storage blades ............4 HP BladeSystem c-Class architecture overview..................4 Component overview ........................... 5 General-purpose compute solution ......................7 Physically scalable form factors......................7 Blade form factors ........................
  • Page 2 Reduced logistical delay time ......................26 Conclusion............................26 For more information.......................... 27 Call to action ............................ 28...

  • Page 3: Abstract

    Abstract This technology brief describes the underlying architecture of the BladeSystem c-Class and how the architecture was designed as a general-purpose, flexible infrastructure. The HP BladeSystem c-Class consolidates power, cooling, connectivity, redundancy, and security into a modular, self-tuning system with intelligence built in. The brief describes how the BladeSystem c-Class architecture solves some major data center and server blade issues.

  • Page 4: Evaluating Requirements For Next-Generation Server And Storage Blades

    Evaluating requirements for next-generation server and storage blades More critically than ever, data center administrators need agile computing resources that they can use fully but can change and adapt as business needs change. Administrators need 24/7 availability and the ability to manage power and cooling costs, even as systems become more power hungry and facility costs rise.

  • Page 5: Component Overview

    An HP BladeSystem c-Class enclosure accommodates server blades, storage blades, I/O option blades, interconnect modules (switches and pass-thru modules), a NonStop passive signal midplane, a passive power backplane, power supplies, fans, and Onboard Administrator modules. The BladeSystem c-Class employs multiple signal paths and redundant hot-pluggable components to provide maximum uptime for components in the enclosure.
  • Page 6 enclosure holding up to eight blades, to a rack containing seven enclosures holding up to 56 server, storage, or option blades total. Figure 2. HP BladeSystem c3000 enclosure (rack-model) as viewed from the front and the rear Figure 3. HP BladeSystem c3000 enclosure (tower model) as viewed from the front and the rear...

  • Page 7: General-Purpose Compute Solution

    The HP BladeSystem enclosures can accommodate half-height or full-height blades in single- or double-wide form factors. The HP website lists the available products: www.hp.com/go/bladesystem/. Optional mezzanine cards within the server blades provide network connectivity by means of the interconnect modules in the interconnect bays at the rear of the enclosure. The connections between server blades and a network fabric can be fully redundant.
  • Page 8 database or with mainstream, 2P blades for web or terminal services. Alternatively, customers can populate the enclosure with some mixture of the two form factors. Figure 4. Form factors evaluated by HP for the BladeSystem c-Class Wide Form Factor Slim Form Factor Single-Wide Double-Wide Full-Height...

  • Page 9: Interconnect Form Factors

    variety of memory technologies that give customers options when weighing memory capacity, power use, and cost. Interconnect form factors HP selected a single-wide/double-wide interconnect form factor to achieve efficient use of space and improved performance. A single interconnect bay can accommodate two smaller interconnect modules in a scale-out configuration or a larger, higher-bandwidth interconnect module for scale-up performance (Figure 5).

  • Page 10: Nonstop Signal Midplane Provides Flexibility

    Figure 6. The scalable device bays and interconnect bays enable redundant star topologies that differ depending on the customer configuration. blades blades Interconnect Module A Interconnect Interconnect Module A Module B Interconnect Module B blades blades NonStop signal midplane provides flexibility The BladeSystem c-Class uses a high-speed, NonStop signal midplane that provides the flexibility to intermingle blades and interconnect fabrics in many ways to solve a multitude of application needs.
  • Page 11 Table 1. Physical layer of I/O fabrics and their associated encoded bandwidths Interconnect Lanes Number Bandwidth Aggregate of traces per lane bandwidth (Gb/s) (Gb/s) 1.25 1.25 (1000-base-KX) 10 GbE (10G-base-KX4) 3.125 12.5 10 GbE (10G-base-KR) 10.3125 10.3125 Fibre Channel 1.06, 2.12, 1.06, 2.12, (1, 2, 4, 8 Gb) 4.2, 8.5...

  • Page 12: Connectivity Between Blades And Interconnect Modules

    Figure 7. Logically overlaying physical lanes (right) onto sets of four traces (left) (SAS, (KX, KR, SAS, PCI Express) Fibre Channel) Lane-0 Lane-0 Lane-1 Lane-0 Lane-0 Lane-1 Lane-1 Lane-2 (KX4, InfiniBand, Lane-2 Lane-3 PCI Express) Lane-3 Connectivity between blades and interconnect modules The c-Class server blades use mezzanine cards to connect to various network fabrics.
  • Page 13 Figure 8. Redundant connection of c-Class half-height server blades in the c7000 to the interconnect bays Figure 9. Connection of c-Class half-height server blades in the c3000 enclosure to the interconnect bays. To provide such inherent flexibility of the NonStop signal midplane, the architecture must provide a mechanism to properly match the mezzanine cards on the server blades with the interconnect...

  • Page 14: Nonstop Signal Midplane Enables Modularity

    modules. For example, within a given enclosure, all mezzanine cards in the mezzanine 1 connector of the server blades must support the same type of fabric. HP developed the electronic keying mechanism in Onboard Administrator to assist system administrators in recognizing and correcting potential fabric mismatch conditions as they configure each enclosure.

  • Page 15: Nonstop Signal Midplane Scalability

    For detailed information about the c-Class server blades, see the technology brief titled “HP ProLiant c-Class server blades,” available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01136096/c01136096.pdf. NonStop signal midplane scalability The NonStop signal midplane is capable of conducting extremely high signal rates of up to 10 Gb/s per lane (that is, per set of four differential transmit/receive traces).

  • Page 16: Separate Power Backplane

    Figure 10. Separation of the transmit and receive signal pins by a ground plane in the in c-Class enclosure midplane Receive Signal Pins Interconnect Bay Connector Transmit Signal Pins Separate power backplane Distributing power on the same PCB that includes the signal traces would have greatly increased the board’s complexity.

  • Page 17: Signal Midplane Provides Reliability

    Figure 11. Different topologies require different emphasis settings Midplane Switch-1 PCB Server blade-1 Switch Device DEV-1 Server blade-4 Onboard DEV-1 Administrator Signal midplane provides reliability Finally, to provide high reliability, the NonStop signal midplane is designed as a completely passive board, meaning that it has no active components along the high-speed signal paths.

  • Page 18: Power Backplane Scalability And Reliability

    Power backplane scalability and reliability The power backplane is constructed of solid copper plates and integrated power delivery pins to ensure power distribution with minimum losses (Figure 12). Using solid copper plates reduces voltage drops, provides high current density, and high reliability. Figure 12.

  • Page 19: Server Blades And Processors

    Server blades and processors At the processor level, HP Power Regulator for ProLiant is a ROM-based power management feature of HP ProLiant servers. Power Regulator technology takes advantage of the power states available on x86 processors to scale back the power to a processor when it is not needed. Because the c-Class architecture shares power among all server blades in an enclosure, administrators can use Power Regulator technology to balance power loads among the server blades.

  • Page 20: Dynamic Power Saver Mode

    Dynamic Power Saver Mode Most power supplies operate inefficiently when lightly loaded and more efficiently when heavily loaded. When enabled, Dynamic Power Savings mode will save power by running the required power supplies at a higher rate of utilization and putting unneeded power supplies in a standby mode.

  • Page 21: Configuration And Management Technologies

    Because the enclosures are designed to include separate physical cooling zones, the Active Cool fans provide cooling for their own zone and redundant cooling for the rest of the enclosure. One or more fans can fail and still leave enough fans to adequately cool the enclosure. To ensure scalability, HP designed both the fans and the power supplies with enough capacity to meet the needs of compute, storage, and I/O components well into the future.
  • Page 22 enclosure to act as a redundant controller in an active-standby mode. In the future, HP plans to offer redundant Onboard Administrator capabilities for the c3000 enclosure. Onboard Administrator collects system parameters related to thermal and power status, system configuration, and managed network configuration. It manages these variables cohesively and intelligently so that IT personnel can configure the BladeSystem c-Class and manage it in a fraction of the time that other solutions require.

  • Page 23: Virtualized Network Infrastructure With Virtual Connect Technology

    Figure 13. The main menu on the Insight Display IT technicians and administrators can access the Onboard Administrator in any of three ways: through the Insight Display, through a web graphical user interface (GUI), or through a command-line interface (CLI). A fourth access method is available for the c3000 enclosure: The optional c3000 KVM Module provides the Onboard Administrator CLI, Insight Display, and KVM console connections to all the server blades in the enclosure.
  • Page 24 Figure 14. HP Virtual Connect technology provides server-edge virtualization From the perspective of the network and storage administrators, the LAN and SAN connections are established with the pool of servers, and the administrators see no changes to their networks. This allows moving workloads and adding or replacing servers without affecting the LAN or SAN.

  • Page 25: Availability Technologies

    Availability technologies The BladeSystem c-Class incorporates layers of availability to enable the 24/7 infrastructure needed in data centers. Using redundant configurations eliminates single points of failure, and the c-Class architecture reduces the risk of component failures and the time required for changes. Redundant configurations The BladeSystem c-Class minimizes the chances of a failure by providing redundant power supplies, fans, and interconnect modules.

  • Page 26: Reduced Logistical Delay Time

    Finally, Onboard Administrator’s thermal monitoring of the entire system ensures that the Active Cool fans deliver adequate cooling to the entire enclosure. Because the fan design uses a high-performance motor and impeller, it consumes less power and uses less airflow to cool an enclosure than a traditional fan design would.

  • Page 27: For More Information

    For more information For additional information, refer to the resources listed below. Source Hyperlink HP BladeSystem c-Class documentation http://h71028.www7.hp.com/enterprise/cache/316735-0-0-0- 121.html www.hp.com/go/bladesystem/powercalculator HP BladeSystem power sizer HP BladeSystem website www.hp.com/go/bladesystem/ HP Power Regulator for ProLiant http://h18000.www1.hp.com/products/servers/management /ilo/power-regulator.html HP Technology Briefs: http://h18013.www1.hp.com/products/servers/technology/ whitepapers/proliant-servers.html#bl HP BladeSystem c-Class c7000 enclosure technologies...

  • Page 28: Call To Action

    Call to action Send comments about this paper to TechCom@HP.com. © Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services.

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