PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE. (COLLECTIVELY, "HIGH RISK APPLICATIONS") You understand and agree that your use of TQ products or devices as a component in your applications are solely at your own risk. To minimize the risks associated with your products, devices and applications, you should take appropriate operational and design related protective measures.
Handling and ESD tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
This Preliminary User's Manual describes the hardware of TQMa95xxSA revision 01xx in combination with the MB-SMARC-2 and refers to some software settings. The MB-SMARC-2 serves as an evaluation board for the TQMa95xxSA. A certain TQMa95xxSA derivative does not necessarily provide all features described in this Preliminary User's Manual. This Preliminary User's Manual does also not replace the NXP i.MX 95 Reference Manual (2).
A suitable i.MX 95 derivative can be selected for each requirement. The signals are routed to the card edge connector according to SMARC 2.1 standard. All essential components like CPU, LPDDR5 SDRAM, eMMC and power management are already integrated on the TQMa95xxSA. The main features of the TQMa95xxSA are: •...
Interfaces to other systems and devices The TQMa95xxSA has a SMARC pin strip with a total of 314 pins, divided between the top and bottom side of the board, via which it is connected to the baseboard. Furthermore, the module has four holes with which it can be fixed to the carrier board by means of screws.
When designing a carrier board, it is recommended to have a redundant update concept for field software updates. Memory LPDDR5-RAM with a memory width of 32 bits is used on the TQMa95xxSA. The i.MX 95 supports Inline ECC. The LPDDR memory interface has the following basic parameters: Table 5: Parameter RAM interface Parameter i.MX 95...
The standard NOR flash is Winbond W25Q512NWBIQ (64 MByte). EEPROM The TQMa95xxSA has two EEPROMs, one customer specific and one SMARC specific. Both are connected to the I2C_GP bus of the TQMa95xxSA and are supplied with 1.8 V. C address of the SMARC-specific EEPROM is set to 0x50 according to the specification. Information about the module The I configuration can be found at this address.
3.12 Optional RTC PCF85063 In addition to the i.MX 95 internal RTC, TQMa95xxSA variants with discrete RTC at I2C_GP are available. It is recommended to use the RTC PCF85063 due to the lower current consumption during standby modes. Unlike the temperature sensor, its interrupt signal is routed directly to a CPU pin. This means that the CPU can be woken up directly by the RTC from any standby mode.
PCIE_C and PCIE_D of the SMARC pins are not assigned to PCIe. Due to the internal CPU circuitry, the clock must be supplied from an external source. For this reason, a PCIe clock generator is provided on the TQMa95xxSA. This is connected via I2C and can control each channel separately.
Trust Secure Element Depending on the module variant, a Trust Secure Element (TSE) is available on the TQMa95xxSA. This is connected to the I2C_GP bus (address: 0x48). The selected chip SE050 from NXP provides additional smartcard interfaces according to ISO14443 and ISO7816 besides the I2C interface.
The SMARC specification specifies a power supply range of 3.0 V to 5.25 V, although this can be further restricted (e.g. to a fixed 3.3 V (3.1 V to 3.4 V)). All supply voltages required by the CPU and the module components are generated by the TQMa95xxSA.
Power-up sequence TQMa95xxSA / carrier board Since the TQMa95xxSA can be operated with a supply voltage of 3.0 V to 5.25 V and all voltages of the CPU signals are generated on the TQMa95xxSA, there are requirements for the mainboard design concerning the timing behavior of the voltages generated on the mainboard.
PF090x. Attention: Malfunction or destruction Improper PMIC programming may cause the i.MX 95 or other peripherals on the TQMa95xxSA to operate outside their specification. This can lead to malfunction, deterioration or destruction of the TQMa95xxSA.
Thermal management To cool the TQMa95xxSA, a maximum of approximately TBD watts must be dissipated, see Table TBD for peak currents. The cooling solution must be able to dissipate this power peak; it will never occur permanently in normal operation.
TQMa95xxSA and thus malfunction, deterioration or destruction. Structural requirements The TQMa95xxSA has a low retention force and has to be mounted / secured according to customer requirements. The superior system is defined by the customer depending on the usage of the TQMa95xxSA.
The operating temperature range for the TQMa95xxSA strongly depends on the installation situation (heat dissipation by heat conduction and convection); hence, no fixed value can be given for the TQMa95xxSA. The TQMa95xxSA is available in three different variants with different temperature ranges. In general, a reliable operation is given when following conditions are met:...
TQ. TQ is not liable for any delivery delays due to national or international export restrictions or for the inability to make a delivery as a result of those restrictions.
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the TQMa95xxSA, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of the TQMa95xxSA is minimised by suitable measures.
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