User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH. TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.
Handling and ESD tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Page 4 BRIEF DESCRIPTION The TQMa62xxL is a universal TQ-LGA mini module based on the TI Sitara family AM62x with ARM Cortex A53 and Cortex M4F cores. This User's Manual describes the hardware of the TQMa62xxL Rev.010x and refers to some software settings.
Please also take note of the latest AM62x errata (3). System components 3.2.1 Processor derivatives Depending on the TQMa62xxL version, one of the following AM62x derivatives is assembled: AM6254 / AM6252 / AM6251 / AM6234 / AM6232 / AM6231 Table 2: AM62x derivatives (Source: Texas...
The following figure shows the implementation of boot strapping on the module: Figure 3: Block diagram boot strapping According to the Reference Manual (2) the general boot configuration at the TQMa62xxL can be set as follows: Table 3: Selecting the General Boot Configuration...
Figure 4: Block diagram DDR3L SDRAM connection 3.2.3.2 eMMC An eMMC is available to the TQMa62xxL as non-volatile data memory for programs and data (e.g. boot loader, operating system). The used MMC0 signals are not available to the Pinout. •...
Further information can be obtained from the associated data sheets (1). 3.2.5 An optional RTC (NXP PCF85063A) can be equipped on the TQMa62xxL. The connection is realized as follows: • The RTC can be supplied from the base board via V_RTC_IN. V_RTC_IN = 2.0 V to 5.5V •...
3.2.6 Secure Element A Secure Element Chip can optionally be fitted on the TQMa62xxL. The connection can be seen in the following figure: Figure 9: Block diagram SEC The SE050E2HQ1/Z01Z3 from NXP is used as the secure element. All I²C addresses are described in chapter 3.2.8.3.
If additional devices should be connected to this bus, optional external pullups should be provided to improve the rise / fall times. I2C0 relates to 1.8V. 3.2.8.4 UART UART0 is routed to the TQMa62xxL pins as primary function. 3.2.8.5 EXTINT# The signal EXTINT# of the AM62x is routed to TQMa62xxL pad W19 as primary function.
Page 16 3.2.11 Power supply 3.2.11.1 Main power supply The main supply of the TQMa62xxL is defined to typ. 3.3 V. By applying the 3.3 V voltage the module generates all required voltages. Figure 13: Block diagram power supply 3.2.11.2 Overview TQMa62xxL supply The following table shows all relevant supply voltages of the TQMa62xxL.
Pin assignment The TQMa62xxL has a total of 366 LGA pads. By using the LGA design, the module is soldered on once and thus has a permanent, stable connection to its peripherals. Removing the module from its soldered-on position is not possible without further ado, is not recommended and can lead to a reduction in service life or to its destruction.
RAM configuration / timing • Muxing • Clocks • Driver strengths When using a different bootloader this data has to be adapted. Details can be requested from TQ support. More information can be found in the Support Wiki for the TQMa62xxL.
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Page 39 MECHANICS TQMa62xxL dimensions and footprint The overall dimensions (length × width) of the TQMa62xxL are 38.0 mm × 38.0 mm (± 0.1 mm). The mass of TQMa62xxL is 9 g (AM6254) (± 2 g). Figure 16: Dimensions TQMa62xxL...
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Figure 17: TQMa62xxL top view Protection against external effects As an embedded module the TQMa62xxL is not protected against dust, external impact and contact (IP00). Adequate protection has to be guaranteed by the surrounding system. Thermal management The power dissipation mainly depends on the software used and can vary according to the application. The power dissipation mainly arises at the processor, the switching regulators and the LPDDR4 devices.
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Structural requirements The TQMa62xxL has to be soldered on the carrier board. The TQMa62xxL is held on the mainboard by the holding force of the solder connections from the LGA pads and requires no further fastening measures. If there are high requirements for vibration and shock resistance, a module holder must be provided in the final application to additionally hold the module in position.
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TQMa95xxSA is only a sub-component of an overall system. Climatic and operational conditions The temperature range, in which the TQMa62xxL works reliably, strongly depends on the installation situation (heat dissipation by heat conduction and convection); hence, no fixed value can be given for the whole assembly.
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TQ. TQ is not liable for any delivery delays due to national or international export restrictions or for the inability to make a delivery as a result of those restrictions.
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By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the TQMa62xxL, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of this subassembly is minimised by suitable measures. The TQMa62xxL is delivered in reusable packaging.
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