Table of Contents
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TABLE OF CONTENTS
SELF DIAGNOSTICS
...................................................... 2
1.
SERVICING NOTES
2.
GENERAL
................................................................... 6
3.
DISASSEMBLY
......................................................... 8
4.
TEST MODE
.............................................................. 21
5.
ELECTRICAL ADJUSTMENTS
MD Section ..................................................................... 24
CD Section ...................................................................... 29
6.
DIAGRAMS
6-1. Printed Wiring Board – BD (CD) Section – .................. 31
6-2. Schematic Diagram – BD (CD) Section – ...................... 33
6-3. Printed Wiring Boards – BD (MD) Section – ............... 36
6-4. Schematic Diagram – BD (MD) Section – .................... 39
6-5. Schematic Diagram – SUB Section – ............................. 44
6-6. Printed Wiring Board – SUB Section – ......................... 49
6-7. Printed Wiring Boards – MAIN Section – .................... 52
6-8. Schematic Diagram – MAIN Section – .......................... 55
6-9. Schematic Diagram –PANEL Section – ......................... 60
6-10. Printed Wiring Boards – PANEL Section – .................. 65
6-11. Printed Wiring Boards
– CD (Motor/ Sensor) Section – .................................... 67
6-12. Schematic Diagram
– CD (Motor/ Sensor) Section – ..................................... 69
6-13. Printed Wiring Boards
– MD (Motor/ Sensor) Section – .................................... 71
6-14. Schematic Diagram
– MD (Motor/ Sensor) Section – .................................... 73
6-15. Printed Wiring Boards
– POWER/AMPLIFIER Section – ................................. 75
6-16. Schematic Diagram
– POWER/AMPLIFIER Section – ................................. 77
6-17. Printed Wiring Boards
– DETACHABLE CONTROLLER Section
(RM-MD515) – .............................................................. 79
6-18. Schematic Diagram
– DETACHABLE CONTROLLER Section
(RM-MD515) – ............................................................... 81
6-19. IC Pin Function Description ........................................... 92
7.
EXPLODED VIEWS
8.
ELECTRICAL PARTS LIST
............................................... 4
............................................... 107
.............................. 117
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
– 4 –
SECTION 1
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